Patent classifications
B23K26/384
METHOD OF FORMING THROUGH HOLE
A method of forming a through hole, wherein a spot of a laser light scans along a predetermined path and forms a through hole includes a first process in which the spot of the laser light circulates along an inner path from a predetermined first point on the inner path and reaches a predetermined second point. The inner path is positioned at an inner side relative to an outer path. The predetermined second point is positioned before the spot of the laser light returns to the predetermined first point. The method includes a second process in which the spot of the laser light moves along a transition path and reaches a predetermined third point on the outer path. The method includes a third process in which the spot of the laser light circulates along the outer path from the predetermined third point and returns to the predetermined third point.
METHOD OF FORMING THROUGH HOLE
A method of forming a through hole, wherein a spot of a laser light scans along a predetermined path and forms a through hole includes a first process in which the spot of the laser light circulates along an inner path from a predetermined first point on the inner path and reaches a predetermined second point. The inner path is positioned at an inner side relative to an outer path. The predetermined second point is positioned before the spot of the laser light returns to the predetermined first point. The method includes a second process in which the spot of the laser light moves along a transition path and reaches a predetermined third point on the outer path. The method includes a third process in which the spot of the laser light circulates along the outer path from the predetermined third point and returns to the predetermined third point.
Inner barrel of an engine inlet with laser-machined acoustic perforations
A forming system includes a femtosecond laser and a control unit that includes one or more processors operatively connected to the femtosecond laser. The femtosecond laser is configured to emit laser pulses onto an inner surface of a face sheet of an acoustic inner barrel. The acoustic inner barrel includes an acoustic core comprising an array of hexagonal cells attached to an outer surface of the face sheet that is opposite the inner surface. The control unit is configured to control the femtosecond laser to laser drill a plurality of perforations in the face sheet via emitting laser pulses at pulse durations between about 100 femtoseconds and about 10,000 femtoseconds and at frequencies over 100,000 Hz such that the perforations are formed without burning portions of the face sheet or the acoustic core surrounding the perforations.
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0 or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.
Location of image plane in a laser processing system
Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.
Location of image plane in a laser processing system
Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.
SYSTEMS AND METHODS FOR MANUFACTURING FILM COOLING HOLE DIFFUSER PORTION
A gas path component for a gas turbine engine includes a film cooling hole disposed in the gas path component. The film cooling hole includes a metering section, a diffuser, and a tapered surface extending between the metering section and the diffuser. The tapered surface is oriented between twenty degrees and seventy degrees with respect to a centerline axis of the metering section. The tapered surface is oriented at an obtuse angle with respect to an immediately adjacent surface of the diffuser, the obtuse angle is open towards the centerline axis. The tapered surface is configured to mitigate flow separation in the diffuser.
SYSTEMS AND METHODS FOR MANUFACTURING FILM COOLING HOLE DIFFUSER PORTION
A gas path component for a gas turbine engine includes a film cooling hole disposed in the gas path component. The film cooling hole includes a metering section, a diffuser, and a tapered surface extending between the metering section and the diffuser. The tapered surface is oriented between twenty degrees and seventy degrees with respect to a centerline axis of the metering section. The tapered surface is oriented at an obtuse angle with respect to an immediately adjacent surface of the diffuser, the obtuse angle is open towards the centerline axis. The tapered surface is configured to mitigate flow separation in the diffuser.
Through electrode substrate and semiconductor device
A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0 or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.
Components with cooling channels and methods of manufacture
A component is provided and includes a substrate comprising an outer and an inner surface, where the inner surface defines at least one hollow, interior space. The component defines one or more grooves, where each groove extends at least partially along the outer surface of the substrate and has a base and a top. The base is wider than the top, such that each groove comprises a re-entrant shaped groove. One or more access holes are formed through the base of a respective groove, to connect the groove in fluid communication with the respective hollow interior space. Each access hole has an exit diameter D that exceeds the opening width d of the top of the respective groove. The diameter D is an effective diameter based on the area enclosed. The component further includes at least one coating disposed over at least a portion of the surface of the substrate, wherein the groove(s) and the coating together define one or more re-entrant shaped channels for cooling the component. A method for manufacturing the component is also provided. A method for manufacturing a component is also provided, where the groove and the access hole(s) are machined as a single continuous process, such that the groove and the access hole(s) form a continuous cooling passage.