A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.

A laser processing apparatus including a condenser having a function of spherical aberration. Since the condenser has a function of spherical aberration, the focal point of a laser beam to be focused by the condenser and applied to a wafer can be continuously changed in position along the thickness of the wafer. Accordingly, a uniform shield tunnel composed of a fine hole and an amorphous region surrounding the fine hole can be formed so as to extend from the front side of the wafer to the back side thereof, by one shot of the laser beam.

A laser processing apparatus including a condenser having a function of spherical aberration. Since the condenser has a function of spherical aberration, the focal point of a laser beam to be focused by the condenser and applied to a wafer can be continuously changed in position along the thickness of the wafer. Accordingly, a uniform shield tunnel composed of a fine hole and an amorphous region surrounding the fine hole can be formed so as to extend from the front side of the wafer to the back side thereof, by one shot of the laser beam.

A method to produce a substrate suitable for diffusion bonding is described. A flexible dielectric substrate is provided. An alkaline modification is applied to the dielectric substrate to form a polyamic acid (PAA) anchoring layer on a surface of the dielectric substrate. A NiP seed layer is elecrolessly plated on the PAA layer. Copper traces are plated within a photoresist pattern on the NiP seed layer. A surface finishing layer is electrolytically plated on the copper traces. The photoresist pattern and NiP seed layer not covered by the copper traces are removed to complete the substrate suitable for diffusion bonding.

A method of forming a passage in a turbine component includes: using an additive manufacturing process to form a first support structure on a first surface of the turbine component; forming a second support structure on a second surface of the turbine component, the second support structure being spaced apart from the first support structure; and forming a passage in the turbine component between the first and second support structures.

A method of forming a passage in a turbine component includes: using an additive manufacturing process to form a first support structure on a first surface of the turbine component; forming a second support structure on a second surface of the turbine component, the second support structure being spaced apart from the first support structure; and forming a passage in the turbine component between the first and second support structures.

An elastic film has a perforation formed by perforation holes that are elongated along a preferred expanding direction in the unexpanded state, wherein the ratio of the length of the perforation holes determined along the preferred expanding direction to a width of the perforation holes determined perpendicular thereto amounts to at least 3:2. The elongation at break along the preferred expanding direction is at least twice as high as the elongation at break determined perpendicular thereto along the width of the perforation holes.

A system and method for fabricating an orifice in a multi-layered semiconductor substrate and singulation of the semiconductor substrate includes adding a sacrificial layer of material to a first surface of a semiconductor substrate; subsequently, removing a first radius of a first depth of material from the semiconductor substrate along a direction normal to the first surface, the removal of the first depth of material uses a first removal technique that removes the first depth of material; and removing a second radius of a second depth of material from the semiconductor substrate along the direction normal to the first surface based on the removal of the first depth of material, the removal of the second depth of material uses a second removal technique.

A system and method for fabricating an orifice in a multi-layered semiconductor substrate and singulation of the semiconductor substrate includes adding a sacrificial layer of material to a first surface of a semiconductor substrate; subsequently, removing a first radius of a first depth of material from the semiconductor substrate along a direction normal to the first surface, the removal of the first depth of material uses a first removal technique that removes the first depth of material; and removing a second radius of a second depth of material from the semiconductor substrate along the direction normal to the first surface based on the removal of the first depth of material, the removal of the second depth of material uses a second removal technique.

The present disclosure discloses a laser cutting base and a laser cutting device. The laser cutting base includes a base body, a recess and a filling structure. The base body includes a first surface configured to fixedly mount an element to be cut. The recess is formed by recessed inwardly from the first surface and corresponds to a position of a cutting line. The filling structure is filled in the recess and is able to prevent debris in the recess during cutting process from rebounding to the element to be cut.