In an embodiment is provided a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer that includes conveying the substrate to a scanning chamber; determining one or more properties of the blind via, the one or more properties comprising a top diameter, a bottom diameter, a volume, or a taper angle of about 80° or more; focusing a laser beam at the substrate to remove at least a portion of the mask layer; adjusting the laser process parameters based on the one or more properties; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. In some embodiments, the mask layer can be pre-etched. In another embodiment is provided an apparatus for forming a blind via in a substrate.

In an embodiment, a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer is provided. The method includes detecting the mask layer by a sensor, the mask layer providing a substrate surface; determining a property of the blind via, the property comprising one or more of a top diameter, a bottom diameter, a volume, or a taper angle; focusing a Gaussian laser beam, under laser process parameters, at the substrate surface to remove at least a portion of the mask layer; adjusting the laser process parameters based on the property; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. The mask layer can be pre-etched. Apparatus for forming a blind via in a substrate are also provided.

In an embodiment, a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer is provided. The method includes detecting the mask layer by a sensor, the mask layer providing a substrate surface; determining a property of the blind via, the property comprising one or more of a top diameter, a bottom diameter, a volume, or a taper angle; focusing a Gaussian laser beam, under laser process parameters, at the substrate surface to remove at least a portion of the mask layer; adjusting the laser process parameters based on the property; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. The mask layer can be pre-etched. Apparatus for forming a blind via in a substrate are also provided.

In an embodiment is provided a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer that includes conveying the substrate to a scanning chamber; determining one or more properties of the blind via, the one or more properties comprising a top diameter, a bottom diameter, a volume, or a taper angle of about 80° or more; focusing a laser beam at the substrate to remove at least a portion of the mask layer; adjusting the laser process parameters based on the one or more properties; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. In some embodiments, the mask layer can be pre-etched. In another embodiment is provided an apparatus for forming a blind via in a substrate.

In an embodiment is provided a method of forming a blind via in a substrate comprising a mask layer, a conductive layer, and a dielectric layer that includes conveying the substrate to a scanning chamber; determining one or more properties of the blind via, the one or more properties comprising a top diameter, a bottom diameter, a volume, or a taper angle of about 80° or more; focusing a laser beam at the substrate to remove at least a portion of the mask layer; adjusting the laser process parameters based on the one or more properties; and focusing the laser beam, under the adjusted laser process parameters, to remove at least a portion of the dielectric layer within the volume to form the blind via. In some embodiments, the mask layer can be pre-etched. In another embodiment is provided an apparatus for forming a blind via in a substrate.

The invention relates to a planar decorative material (11) comprising perforations (12), for interior fittings, in particular for the automobile industry, which decorative material serves to be illuminated on the rearward face (13) thereof, by an illumination means (18), and allows a portion of the light from the illumination means (18) to pass from the rear face (13) of the decorative material (11), through the perforations (12), to the visible side (14) of the decorative material (11), wherein a film (20) is adhesively bonded to the rear face (13) of the decorative material (11) and the perforations (12) extend from the rear face (13) of the decorative material (11) as far as the visible side (14) thereof, but not through the film (20). (FIG. 2)

The present invention also relates to a production method.

The invention relates to a planar decorative material (11) comprising perforations (12), for interior fittings, in particular for the automobile industry, which decorative material serves to be illuminated on the rearward face (13) thereof, by an illumination means (18), and allows a portion of the light from the illumination means (18) to pass from the rear face (13) of the decorative material (11), through the perforations (12), to the visible side (14) of the decorative material (11), wherein a film (20) is adhesively bonded to the rear face (13) of the decorative material (11) and the perforations (12) extend from the rear face (13) of the decorative material (11) as far as the visible side (14) thereof, but not through the film (20). (FIG. 2)

The present invention also relates to a production method.

A forming system includes a femtosecond laser and a control unit that includes one or more processors operatively connected to the femtosecond laser. The femtosecond laser is configured to emit laser pulses onto an inner surface of a face sheet of an acoustic inner barrel. The acoustic inner barrel includes an acoustic core comprising an array of hexagonal cells attached to an outer surface of the face sheet that is opposite the inner surface. The control unit is configured to control the femtosecond laser to laser drill a plurality of perforations in the face sheet via emitting laser pulses at pulse durations between about 100 femtoseconds and about 10,000 femtoseconds and at frequencies over 100,000 Hz.

A metallic ball pen tip for a writing instrument comprising a feeding passage extending in an axial direction, the feeding passage reaching in a recess configured to receive a ball, the recess being defined by a cylindrical wall and a ball seat, wherein the ball seat comprises a plurality of feeding grooves and wherein the ball seat is textured, the texture comprising a plurality of blind holes having a depth equal to or smaller than 50 μm, preferably equal to or smaller than 10 μm, more preferably equal to or smaller than 5 μm, more preferably equal to or smaller than 1 μm, the blind holes having a total surface equal to or greater than 20% of the ball seat, preferably 60% and equal to or smaller than 90% of the ball seat, preferably 85%. A method of manufacturing a metallic ball pen tip.

A metallic ball pen tip for a writing instrument comprising a feeding passage extending in an axial direction, the feeding passage reaching in a recess configured to receive a ball, the recess being defined by a cylindrical wall and a ball seat, wherein the ball seat comprises a plurality of feeding grooves and wherein the ball seat is textured, the texture comprising a plurality of blind holes having a depth equal to or smaller than 50 μm, preferably equal to or smaller than 10 μm, more preferably equal to or smaller than 5 μm, more preferably equal to or smaller than 1 μm, the blind holes having a total surface equal to or greater than 20% of the ball seat, preferably 60% and equal to or smaller than 90% of the ball seat, preferably 85%. A method of manufacturing a metallic ball pen tip.