Laminate components and methods for forming the same are provided. In one exemplary aspect, one or more features are laser cut into or along a laminate component or laminate sections thereof. The features are laser cut into or along the laminate component in an atmosphere. In this manner, and oxide layer is formed on the laser cut surfaces of the future. The features are laser cut into or along the laminate component or laminate sections thereof prior to an infiltration process, such as melt infiltration or chemical vapor infiltration. Accordingly, when the laminate component is infiltrated with an infiltration material, the infiltration material is prevented from infiltrating therethrough.

The present disclosure provides a laser processing device and a processing method for forming a fine structure on a substrate. The laser processing device includes a laser, a stage, an optical system, a pattern generation system, and a control system. The laser emits laser light. The stage supports the substrate. The optical system guides the laser light emitted by the laser to the substrate, thereby irradiating a light beam to the substrate, and the light beam is inclined relative to a surface of the substrate. The pattern generation system prepares a processing pattern of the fine structure. The control system controls the laser, the stage, and the optical system according to the processing pattern.

An example laser tool is configured to operate within a wellbore of a hydrocarbon-bearing rock formation. The laser tool includes one or more optical transmission media as part of an optical path originating at a laser generator configured to generate a laser beam having an axis. The laser tool includes an optical element for receiving the laser beam from the one or more optical transmission media and for output to the hydrocarbon-bearing rock formation. The laser tool includes a purging head for removing dust or vapor from a path of the laser beam. The purging head is for discharging two or more purging gas streams. The purging head may include a coaxial flow assembly and a helical flow assembly. A coaxial purging gas stream may flow in a direction parallel to the axis. A helical purging gas stream may flow in a helical pattern around and substantially along the axis.

A laser processing method for a substrate with a device formed on a front surface thereof and including an electrode pad, the method including: a laser beam applying step of applying the laser beam to the back surface of the substrate to form a fine hole in the substrate at a position corresponding to the electrode pad; a detecting step of detecting first plasma light emitted from the substrate at the same time that the fine hole is formed in the substrate by the laser beam applied thereto, and second plasma light emitted from the electrode pad; and a laser beam irradiation finishing step of stopping application of the laser beam when the second plasma light is detected in the detecting step. A peak power density of the laser beam to be applied is set in a range from 175 GW/cm.sup.2 or less to 100 GW/cm.sup.2 or more.

Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

A laser processing method for applying a laser beam to the reverse side of a substrate with a device formed on a face side thereof and including an electrode pad, to form a pore in the substrate that leads to the electrode pad, includes an irradiation area setting step of detecting the size of the electrode pad and setting an irradiation area for the laser beam such that the pore to be formed is positioned within the electrode pad. After the irradiation area setting step has been performed, the laser beam is applied to the reverse side of the substrate to form a pore in the substrate at a position corresponding to the electrode pad. First plasma light emitted from the substrate and second plasma light emitted from the electrode pad are detected. When the second plasma light is detected, the beam is stopped from being applied to the substrate.

A method of forming a through hole, wherein a spot of a laser light scans along a predetermined path and forms a through hole includes a first process in which the spot of the laser light circulates along an inner path from a predetermined first point on the inner path and reaches a predetermined second point. The inner path is positioned at an inner side relative to an outer path. The predetermined second point is positioned before the spot of the laser light returns to the predetermined first point. The method includes a second process in which the spot of the laser light moves along a transition path and reaches a predetermined third point on the outer path. The method includes a third process in which the spot of the laser light circulates along the outer path from the predetermined third point and returns to the predetermined third point.

A method of forming a through hole, wherein a spot of a laser light scans along a predetermined path and forms a through hole includes a first process in which the spot of the laser light circulates along an inner path from a predetermined first point on the inner path and reaches a predetermined second point. The inner path is positioned at an inner side relative to an outer path. The predetermined second point is positioned before the spot of the laser light returns to the predetermined first point. The method includes a second process in which the spot of the laser light moves along a transition path and reaches a predetermined third point on the outer path. The method includes a third process in which the spot of the laser light circulates along the outer path from the predetermined third point and returns to the predetermined third point.

A method for fabricating a printed circuit, comprising: darkening a surface location of a conductive material with one or more ultrafast pulses of laser radiation and ablating the conductive material at the surface location with one or more longer duration pulses of laser radiation to produce traces or micro via patterns on the surface of a PCB. A hole for a blind micro via is produced by ablating the conductive material at the darkened surface location with one or more longer duration pulses of laser radiation and cleaning a second conductive material under the substrate with one or more further longer duration pulses of laser radiation.