Patent classifications
B23K26/386
Patterning and removal of circuit board material using ultrafast lasers
A method for fabricating a printed circuit, comprising: darkening a surface location of a conductive material with one or more ultrafast pulses of laser radiation and ablating the conductive material at the surface location with one or more longer duration pulses of laser radiation to produce traces or micro via patterns on the surface of a PCB. A hole for a blind micro via is produced by ablating the conductive material at the darkened surface location with one or more longer duration pulses of laser radiation and cleaning a second conductive material under the substrate with one or more further longer duration pulses of laser radiation.
Inner barrel of an engine inlet with laser-machined acoustic perforations
A forming system includes a femtosecond laser and a control unit that includes one or more processors operatively connected to the femtosecond laser. The femtosecond laser is configured to emit laser pulses onto an inner surface of a face sheet of an acoustic inner barrel. The acoustic inner barrel includes an acoustic core comprising an array of hexagonal cells attached to an outer surface of the face sheet that is opposite the inner surface. The control unit is configured to control the femtosecond laser to laser drill a plurality of perforations in the face sheet via emitting laser pulses at pulse durations between about 100 femtoseconds and about 10,000 femtoseconds and at frequencies over 100,000 Hz such that the perforations are formed without burning portions of the face sheet or the acoustic core surrounding the perforations.
Backlit decorative surface, particularly for the interior finishing of motor vehicles
The invention relates to a planar decorative material (11) comprising perforations (12), for interior fittings, in particular for the automobile industry, which decorative material serves to be illuminated on the rearward face (13) thereof, by an illumination means (18), and allows a portion of the light from the illumination means (18) to pass from the rear face (13) of the decorative material (11), through the perforations (12), to the visible side (14) of the decorative material (11), wherein a film (20) is adhesively bonded to the rear face (13) of the decorative material (11) and the perforations (12) extend from the rear face (13) of the decorative material (11) as far as the visible side (14) thereof, but not through the film (20). The present invention also relates to a production method.
Backlit decorative surface, particularly for the interior finishing of motor vehicles
The invention relates to a planar decorative material (11) comprising perforations (12), for interior fittings, in particular for the automobile industry, which decorative material serves to be illuminated on the rearward face (13) thereof, by an illumination means (18), and allows a portion of the light from the illumination means (18) to pass from the rear face (13) of the decorative material (11), through the perforations (12), to the visible side (14) of the decorative material (11), wherein a film (20) is adhesively bonded to the rear face (13) of the decorative material (11) and the perforations (12) extend from the rear face (13) of the decorative material (11) as far as the visible side (14) thereof, but not through the film (20). The present invention also relates to a production method.
Laser processing method
A laser processing method for processing a substrate having a device formed on the front side, an electrode pad being formed on the device. The method includes applying a pulsed laser beam to the back side of the substrate at a position corresponding to the electrode pad, thereby forming a fine hole in the substrate so that the fine hole reaches the electrode pad, detecting first plasma light generated from the substrate by the application of the pulsed laser beam to the substrate and also detecting second plasma light generated from the electrode pad by the application of the pulsed laser beam to the electrode pad, and stopping the laser beam when the second plasma light is detected. Time intervals of the pulsed laser beam repeatedly applied to the same fine hole are set to 0.1 ms or more.
PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR ELEMENT MANUFACTURING METHOD, SEMICONDUCTOR LASER ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR LASER ELEMENT
A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction.
PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR ELEMENT MANUFACTURING METHOD, SEMICONDUCTOR LASER ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR LASER ELEMENT
A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction.
Fixation leg for a vehicle interior panel and method of manufacturing same
A fixation leg for a vehicle interior panel includes an impact energy absorption region having one or more partial or complete perforations. Each one of the perforations may be formed by laser ablating material from the fixation leg at the impact energy absorption region. The impact energy absorption region is weakened due to the partial or complete perforations such that upon impact with the vehicle interior panel, the fixation leg can break and absorb some of the impact energy. In one embodiment, the fixation leg attaches a substrate of a vehicle instrument panel to a structural crossmember.
SUPERHYDROPHOBIC PLASTIC CONVEYOR COMPONENTS AND METHODS FOR THEIR MOLDING
Superhydrophobic conveyor belt components and methods for molding those components out of thermoplastic polymers. The plastic components have superhydrophobic regions on outer surfaces that shed aqueous solutions and remain dry. The water-shedding regions are textured with a nano- or micro-structure that is rough enough to endow the region with superhydrophobic properties.
SUPERHYDROPHOBIC PLASTIC CONVEYOR COMPONENTS AND METHODS FOR THEIR MOLDING
Superhydrophobic conveyor belt components and methods for molding those components out of thermoplastic polymers. The plastic components have superhydrophobic regions on outer surfaces that shed aqueous solutions and remain dry. The water-shedding regions are textured with a nano- or micro-structure that is rough enough to endow the region with superhydrophobic properties.