Methods and systems for laser cutting of components are disclosed herein. Examples are specifically suited for laser cutting relatively large components of e.g. a vehicle framework such as a unitary side panel of a vehicle door. Multiple robots may perform laser cutting operations substantially simultaneously.

Methods and systems for laser cutting of components are disclosed herein. Examples are specifically suited for laser cutting relatively large components of e.g. a vehicle framework such as a unitary side panel of a vehicle door. Multiple robots may perform laser cutting operations substantially simultaneously.

Methods and systems for laser cutting of components are disclosed herein. Examples are specifically suited for laser cutting relatively large components of e.g. a vehicle framework such as a unitary side panel of a vehicle door. Multiple robots may perform laser cutting operations substantially simultaneously.

Methods and systems for laser cutting of components are disclosed herein. Examples are specifically suited for laser cutting relatively large components of e.g. a vehicle framework such as a unitary side panel of a vehicle door. Multiple robots may perform laser cutting operations substantially simultaneously.

A method for manufacturing a stone for a timepiece from a mineral body of a monocrystalline type, the stone including a hole, includes ablating the body by scanning at least one face of the body with ultra-short pulse laser radiation from a laser for a duration less than one hundred picoseconds, and guiding a beam of the laser radiation using a precession system of at least three axes configured to at least partially cancel a conical focusing angle of the laser. The ablating includes digging of a cone of entrance to the hole. A mineral stone of monocrystalline type for a timepiece includes a face provided with a hole formed in a body of the stone, and a functional element at an entrance to the hole. The functional element has a shape of a cone.

Provided is a method for drilling an edible body in which a release hole for releasing an active ingredient accommodated in the edible body to the outside is formed on a surface of the edible body, wherein the method comprises a laser irradiation step of forming multiple closed curves on the surface of the edible body by laser irradiation. In the laser irradiation step, after one closed curve C1 is formed, another closed curve C2 is formed along an inner side or an outer side of the closed curve C1, and the closed curves C1 and C2 are brought into contact with each other in a line width direction to form the release hole 104, so that drilling into the edible body can be easily and reliably performed.

Provided is a method for drilling an edible body in which a release hole for releasing an active ingredient accommodated in the edible body to the outside is formed on a surface of the edible body, wherein the method comprises a laser irradiation step of forming multiple closed curves on the surface of the edible body by laser irradiation. In the laser irradiation step, after one closed curve C1 is formed, another closed curve C2 is formed along an inner side or an outer side of the closed curve C1, and the closed curves C1 and C2 are brought into contact with each other in a line width direction to form the release hole 104, so that drilling into the edible body can be easily and reliably performed.

The present invention relates to an assembly for material processing using a laser beam, in particular for laser drilling, comprising a dynamic deflection device (AE) for the laser beam (LS), and an optical assembly, with which a laser beam (LS) exiting the deflection device (AE) is focused onto a processing plane (W). Along an optical axis, the optical assembly has a first optical system (OS1) and a second optical system (OS2), which are designed and arranged such that the laser beam (LS) forms an intermediate focus (ZF) between the first and the second optical system (OS1, OS2), and intersects the optical axis when entering the first optical system (OS1) at an angle to the optical axis and at a distance therefrom between the second optical system (OS2) and the processing plane (W). The suggested assembly has a simple, stable structure, with which efficient ablation of large and deep boreholes or cuts in a workpiece is enabled.

The present invention relates to an assembly for material processing using a laser beam, in particular for laser drilling, comprising a dynamic deflection device (AE) for the laser beam (LS), and an optical assembly, with which a laser beam (LS) exiting the deflection device (AE) is focused onto a processing plane (W). Along an optical axis, the optical assembly has a first optical system (OS1) and a second optical system (OS2), which are designed and arranged such that the laser beam (LS) forms an intermediate focus (ZF) between the first and the second optical system (OS1, OS2), and intersects the optical axis when entering the first optical system (OS1) at an angle to the optical axis and at a distance therefrom between the second optical system (OS2) and the processing plane (W). The suggested assembly has a simple, stable structure, with which efficient ablation of large and deep boreholes or cuts in a workpiece is enabled.