Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

A transportation device for transferring bristles from one location to another location comprises a tube system and a baffle plate comprising conically shaped vents. The baffle plate is arranged at one end of the tube system in order to stop the movement of the bristles transported inside the tube system using airflow. Such a transportation system may be part of a device for automated production of brushes, in particular toothbrushes. A plurality of bristles can be transferred by such transportation system in order to be arranged in a pre-defined bristle pattern corresponding to a bristle field of a brush, in particular a tooth brush.

A transportation device for transferring bristles from one location to another location comprises a tube system and a baffle plate comprising conically shaped vents. The baffle plate is arranged at one end of the tube system in order to stop the movement of the bristles transported inside the tube system using airflow. Such a transportation system may be part of a device for automated production of brushes, in particular toothbrushes. A plurality of bristles can be transferred by such transportation system in order to be arranged in a pre-defined bristle pattern corresponding to a bristle field of a brush, in particular a tooth brush.

The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO.sub.2 laser beam, aligning the CO.sub.2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.

The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO.sub.2 laser beam, aligning the CO.sub.2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.

A scrap removal device for a laser processing device includes a gas deflector having an optical channel; a looped gas channel; and a looped gas outlet. The looped gas outlet is connected to the looped gas channel, the optical channel is configured for a laser beam to transmit through, the looped gas channel surrounds the optical channel, and a section of the looped gas channel close to the looped gas outlet is inclined. The scrap removal device further includes a gas source furnished on the gas deflector and in communication with the looped gas channel for providing a gas flow to flow into the looped gas channel. The gas flow is joined with the laser beam transmitting along a looped processing path when flowing out of the gas deflector through the looped gas channel and the looped gas outlet.

A scrap removal device for a laser processing device includes a gas deflector having an optical channel; a looped gas channel; and a looped gas outlet. The looped gas outlet is connected to the looped gas channel, the optical channel is configured for a laser beam to transmit through, the looped gas channel surrounds the optical channel, and a section of the looped gas channel close to the looped gas outlet is inclined. The scrap removal device further includes a gas source furnished on the gas deflector and in communication with the looped gas channel for providing a gas flow to flow into the looped gas channel. The gas flow is joined with the laser beam transmitting along a looped processing path when flowing out of the gas deflector through the looped gas channel and the looped gas outlet.

A method for manufacturing a member having a through hole includes a primary formation step, an intensity determination step, a laser modulation step, and a secondary formation step. The primary formation step includes radiating a laser beam to a workpiece member to form a pilot hole having a smaller inner diameter than the through hole while receiving light from the workpiece member at a light detection unit. The intensity determination step includes determining whether a light intensity is equal to or less than a predetermined threshold value. The laser modulation step includes modulating a spatial light phase of the laser beam the intensity of the light is equal to or less than the predetermined threshold value. The secondary formation step includes radiating the laser beam having the modulated spatial light phase to a peripheral part of the pilot hole to form the through hole.

A method for manufacturing a member having a through hole includes a primary formation step, an intensity determination step, a laser modulation step, and a secondary formation step. The primary formation step includes radiating a laser beam to a workpiece member to form a pilot hole having a smaller inner diameter than the through hole while receiving light from the workpiece member at a light detection unit. The intensity determination step includes determining whether a light intensity is equal to or less than a predetermined threshold value. The laser modulation step includes modulating a spatial light phase of the laser beam the intensity of the light is equal to or less than the predetermined threshold value. The secondary formation step includes radiating the laser beam having the modulated spatial light phase to a peripheral part of the pilot hole to form the through hole.