A method of forming a passage in a turbine component that includes using an additive manufacturing process to form a first support structure on a first surface of the turbine component; and forming a passage through the first support structure and the turbine component.

An engraved code includes a plurality of dot dented portions defined on an article. The engraved code includes an opening peripheral edge portion of each of the dot dented portions which has a polygonal or quadrilateral shape. This configuration leads to detection of each dot dented portion as a polygonal or quadrilateral dot.

Disclosed techniques include creating a pressure differential within an interior of a dual-wall component relative to pressure at an exterior of the dual-wall component, fabricating a hole in a first wall of the dual-wall component, while fabricating the hole in the first wall of the dual-wall component, acoustically monitoring the hole fabrication, while acoustically monitoring the hole fabrication, detecting breakthrough of the first wall of the dual-wall component based on an acoustic signal due to gas passing through the fabricated hole, and based on the acoustic signal, ceasing the fabrication of the hole.

A process of repairing a component includes identifying a void in a component; determining at least one approximate physical configuration of the void; inserting borescope into the component in order to view the void; providing a repair rod approximately equivalent to at least one of the least one approximate physical configuration of the void; inserting the repair rod into component; confirming insertion of the repair rod in the void; separating the repair rod to leave a repair plug in the void; and depositing braze paste over the repair plug in the void.

A method of micro machining a workpiece; a micro machining apparatus and a micro machined workpiece. The method includes the steps of laser cutting a test bore in a test piece using a laser beam; measuring the test bore using either a measurement probe or an electrode; correlating the electrode to the laser beam; laser ablating the surface the workpiece in a first region; and electrical discharge machining the workpiece in the first region to produce at least one bore in the workpiece. The workpiece has a surface coating and at least one bore, wherein the bore passes through the surface coating with a diameter that is within 0.3 mm of the diameter of the bore in the remainder of the workpiece.

A forming system includes a femtosecond laser and a control unit that includes one or more processors operatively connected to the femtosecond laser. The femtosecond laser is configured to emit laser pulses onto an inner surface of a face sheet of an acoustic inner barrel. The acoustic inner barrel includes an acoustic core comprising an array of hexagonal cells attached to an outer surface of the face sheet that is opposite the inner surface. The control unit is configured to control the femtosecond laser to laser drill a plurality of perforations in the face sheet via emitting laser pulses at pulse durations between about 100 femtoseconds and about 10,000 femtoseconds and at frequencies over 100,000 Hz such that the perforations are formed without burning portions of the face sheet or the acoustic core surrounding the perforations.

A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.

A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.

A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.

A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.