A spray tip for a fluid applicator includes a stem configured to be inserted into the fluid applicator. The stem includes a stem pre-orifice portion and an insert receiving portion. The spray tip includes a pre-orifice insert having an inlet and an outlet. The pre-orifice insert is disposed within the insert receiving portion and disposed against a rearward shoulder of the stem.

In a substrate processing method in which, for a substrate including a first layer made of a glass substrate and second layers made of a material different from that of the first layer and provided on a front surface and a back surface of the first layer, respectively, an intended mark is formed in each of the second layers, the substrate processing method includes the step of irradiating with a laser beam having an energy density capable of processing the second layers but incapable of processing the first layer from one surface side of the substrate, thereby simultaneously forming the mark at corresponding positions on each of a front surface and a back surface of the substrate.

By using a water-based liquid mixture containing amino acids, the cavities of a hollow component can be filled very easily and very quickly, while nevertheless providing the internal structure with adequate protection. In addition, the filling material can be removed again very easily after the laser drilling.

A forming system includes a femtosecond laser and a control unit that includes one or more processors operatively connected to the femtosecond laser. The femtosecond laser is configured to emit laser pulses onto an inner surface of a face sheet of an acoustic inner barrel. The acoustic inner barrel includes an acoustic core comprising an array of hexagonal cells attached to an outer surface of the face sheet that is opposite the inner surface. The control unit is configured to control the femtosecond laser to laser drill a plurality of perforations in the face sheet via emitting laser pulses at pulse durations between about 100 femtoseconds and about 10,000 femtoseconds and at frequencies over 100,000 Hz.

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.

A bonded dissimilar material structure includes a first component made of a first dissimilar material; a second component made of a second dissimilar material stacked under the first component; and a plurality of blind holes formed on an upper surface of the second component; and the first component has a plurality of protrusions formed in the plurality of blind holes on the second component, respectively.

Through_holes having a high contour accuracy are produced by the multiple use of a nanosecond laser without that the interface between the ceramic layer and the substrate is damaged.

A gas flow can be provided together with a liquid jet guided laser beam to remove accumulated liquid on the processing surface. The gas flow can be configured to have minimum interference with the liquid jet guided laser beam, while functions to blow away liquid generated by the liquid jet. Keeping the surface free from accumulated liquid can improve the efficiency of the liquid jet guided laser processing.

The invention is method, and an apparatus for performing the method having the steps of providing a workpiece, generating a plurality of free electrons at a region of the exterior surface, and machining a portion of the workpiece adjoining the first region by directing laser energy onto the workpiece.

A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.