A boring device includes: a rotatable body, which has a workpiece holder, a valve seat receiver and a debris passage portion; a laser emitter; a pump and a control unit. The workpiece holder can hold a nozzle body. The valve seat receiver contacts a valve seat of the nozzle body that is held by the workpiece holder. The laser emitter emits a laser beam to an outer wall of the nozzle body to bore injection holes at the nozzle body. The debris passage portion includes a debris passage that is placed on a radially inner side of the valve seat receiver and guides debris formed at the time of boring the injection holes with the laser beam. The pump vacuums the debris through the debris passage. The control unit controls a laser output power of the laser emitter and a suction force of the pump.

A method to form a hole in a ceramic matrix composite component may be provided. A monolithic rod may be inserted into a porous ceramic preform. The ceramic preform may be formed into a ceramic matrix composite body that includes the monolithic rod. A portion of the monolithic rod may be removed, leaving a remaining portion in the ceramic matrix composite body. The remaining portion may include walls that define the opening in the ceramic matrix composite body. Alternatively or in addition, a ceramic matrix composite component may be provided. The ceramic matrix composite component may comprise a ceramic matrix composite body that includes a portion of a monolithic rod. The portion of the monolithic rod forms a lining around a hole passing partly or entirely through a length of the monolithic rod.

An apparatus for high speed laser drilling of tablets, particularly controlled-release tablets is disclosed. The apparatus comprises of a rotary disk (118) with radial slots (401) to hold the tablets in position with help of centrifugal force. The apparatus further comprises a laser system (120) configured to fire a laser beam in order to draw a line of required length on tablets to drill a precise hole at high speed. The laser system (120) is enabled to draw a line on tablet at a speed equal to that of rotational speed of tablets on the rotary disk (118).

Disclosed is a method for manufacturing a circuit board, including preparing a substrate having a resin layer and a stop layer, forming at least one conduction hole penetrating the resin layer and stopping at the stop layer, forming a first metal layer through a sputtering process, forming a second metal layer on the first metal layer through a chemical plating process, forming a third metal layer having a circuit pattern, exposing part of the second metal layer and filling up the conduction hole through an electroplating process, and etching the second metal layer and the first metal layer under the second metal layer to expose the resin layer under the first metal layer. Since the first metal layer provides excellent surface properties, the second and third metal layers are well fixed and stable. The etched circuit pattern has a line width/pitch less than 10 μm for fine line width/pitch.

A method is for processing a cooling hole on a workpiece with laser. The cooling hole includes a shaped hole section. The method includes emitting a first laser pulse to a rough processing part in the position of the shaped hole section to be processed on the workpiece according to the geometrical parameters of the shaped hole section so as to remove the material of the workpiece; and emitting a second laser pulse to the processing allowance part beyond the rough processing part of the shaped hole section to be processed according to the geometrical parameters of the shaped hole section so as to remove the material allowance of the workpiece on the processing allowance part. The energy of the first laser pulse is relatively larger than that of the second laser pulse.

Systems and methods according to one or more embodiments are provided for forming canted holes in materials. In one example, a forming angle and a central axis for a vent through a panel is determined. A vent is formed in the panel about the central axis along the forming angle. The angled vent is formed with a circular shape at a first opening of the vent on a first surface of the panel when viewed at an angle perpendicular to the first surface of the panel. Additional systems and methods are also provided.

A component made of a quartz blank is used as a component part of a CVD reactor. At least one cavity of the component is created by selective laser etching, wherein a fluid flows through the at least one cavity. When in use, the component is heated to temperatures in excess of 500° C., and comes into contact with hydrides of the main groups IV, V or VI and/or with organometallic compounds or halogenides of elements of the main groups II, III or V.

The invention relates to a method of forming a void with a circular cross section in a substrate, more particularly to forming through holes electronic substrates The method comprising the steps of causing a laser cutter to traverse in an arc to an intended circumference of the void, traversing the intended circumference of the void at least once, wherein the lead in from the arc to the circumference comprises a radius.

A method for producing through-holes in a wall of a component, by laser radiation is provided, that includes a wall delimiting a cavity in which a protection agent is provided that can be liquefied when heated. According to the method, through-holes are successively produced in the wall of the component in a plurality of defined points, two directly subsequent through-holes being produced such that a through-hole is produced in a predetermined point and the next through-hole is produced in an additional point which is further away from the predetermined point than at least two, in particular three or more omitted points that are closer to the predetermined point, and/or are produced such that a through-hole is produced in a predetermined point and the next through-hole is produced an additional point.

Laser systems and methods insert a settling time before and after each tooling action. A peak AOD excursion generally occurs at the transition in velocity between inter-feature moves and tooling moves. This transition occurs both before tooling (on the approach to the tooling location) and after tooling (on the departure from the completed tooling location to the next location). By adding a settling delay on each end of the tooling period, the AOD excursion is allowed to settle to a lower value. This then allows higher inter-tooling velocities (for high throughput) while keeping the AOD travel excursion within the bounds of the system's AOD configuration.