An aluminum alloy brazing sheet, a manufacturing method therefor, and a manufacturing method for an automotive heat exchanger. The aluminum alloy brazing sheet includes an aluminum alloy core material, a first brazing material that is clad to one surface of the core material, and a second brazing material that is clad to the other surface of the core material. The core material, the first brazing material, and the second brazing material each include a respective prescribed aluminum alloy. A count of an Al—Si—Fe intermetallic compound having an equivalent circle diameter of 0.5 to 80.0 μm in the second brazing material is less than or equal to 2,000 particles per mm.sup.2.

The present invention relates to a process for the production of an aluminium multilayer brazing sheet which comprises a core layer made of a 3xxx alloy comprising 0.1 to 0.25 wt. % Mg, a brazing layer made of a 4xxx alloy on one or both sides of the core layer, and optionally an interlayer between the core layer and the brazing layer on one or both sides of the core layer, the process comprising the successive steps of: providing the layers to be assembled or simultaneous casting of the layers to obtain a sandwich; rolling of the resulting sandwich to obtain a sheet; and treating the surface of the sheet with an alkaline or acidic etchant.

An aluminum alloy heat exchanger includes a core material formed of an aluminum alloy comprising Mn of 0.60 to 2.00 mass % and Cu of 1.00 mass % or less, with the balance being Al and inevitable impurities, and a sacrificial anode material formed of an aluminum alloy comprising Zn of 2.50 to 10.00 mass %, with the balance being Al and inevitable impurities. Pitting potential of a sacrificial anode material surface of a tube of the aluminum alloy heat exchanger in a 5% NaCl solution is −800 (mV vs Ag/AgCl) or less, and pitting potential of an aluminum fin of the aluminum alloy heat exchanger in a 5% NaCl solution is less than the pitting potential of the sacrificial anode material surface of the tube of the aluminum alloy heat exchanger in a 5% NaCl solution.

A sacrificial material on one surface of a core material, a Al brazing material containing Si: 6.0% to 14.0%, Mg: 0.05% to 1.5%, Bi: 0.05% to 0.25%, Sr: 0.0001% to 0.1%, and Al balance and satisfying (Bi+Mg)×Sr≤0.1 is disposed on the other surface, Mg—Bi-based compounds of the brazing material with a diameter of 0.1-5.0 μm are more than 20 per 10,000-μm.sup.2 and the Mg—Bi-based compounds with a diameter of 5.0 μm or more are less than 2 before brazing, the core material contains Mn: 1.0% to 1.7%, Si: 0.2% to 1.0%, Fe: 0.1% to 0.5%, Cu: 0.08% to 1.0%, Mg: 0.1% to 0.7%, and Al balance, the sacrificial material contains Zn: 0.5% to 6.0% and Mg of which a content is limited to 0.1% or less, and a Mg concentration on a surface of the sacrificial material after brazing is 0.15% or less.

A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.

The invention relates to a lead-free solder foil for diffusion soldering and to the method for its production, with which method metallic structural parts and/or metallized/metal-coated structural parts, i.e. metallic surface layers of adjacent structural parts, may be bonded to one another. The task of the invention is to provide an economic and environmentally friendly lead-free solder foil that is not hazardous to health for diffusion soldering, with which the structural parts to be soldered can be bonded to one another in such a way, in a process temperature range typical of the soft soldering, i.e. at approximately 240° C. and in soldering times of shorter than 5 minutes, without a subsequent heat treatment and without the exertion of a pressing force during the soldering, that a continuous layer of a high-melting bonding zone is obtained in the form of an intermetallic phase having a remelting temperature of higher than 400° C. The lead-free solder foil (1) according to the invention for diffusion soldering contains a solder composite material (4), which is produced by roll-plating and which is then constructed in such a way that, in a lead-free soft-solder environment of a soft-solder matrix (5), compact particles (6) of a high-melting metal component (7) are completely surrounded by lead-free soft solder (8), wherein the dispersedly distributed particles (6) of the high-melting metal component (7) have a thickness of 3 μm to 20 μm in the direction of the foil thickness, the spacings of the particles (6) relative to one another in the soft-solder matrix (5) are 1 μm to 10 μm, each of the particles of the high-melting metal component (7) is enveloped all around by a layer, 1 μm to 10 μm thick, of the lead-free soft solder (8), and the solder foil (1) has, adjacent to the metallic surface layers (3) of the structural parts (2) to be joined, an outer cladding layer (10), the layer thickness of which is 2 μm to 10 μm and which consists of soft solder (8).

The invention concerns a brazing sheet comprising a core layer (5) and a braze cladding, said core layer (5) being aluminium or an aluminium alloy, said braze cladding comprising (a) a flux composite layer (2), which flux composite layer comprises a matrix of aluminium or an aluminium alloy, said matrix containing flux particles; (b) at least one filler alloy layer (1) not containing flux particles; and, (c) an aluminium or aluminium alloy layer (3) not containing flux particles, said layer forming the outermost surface of at least one side of the brazing sheet, wherein the flux composite layer (a) is positioned between said filler alloy layer (b) and said aluminium or aluminium alloy layer (c). The invention further concerns a method for its manufacturing, a cladding plate, use of the brazing sheet and a brazed heat exchanger.

A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.

An aluminum alloy clad material includes: a sacrificial material on one surface of a core material; and an Al—Si—Mg—Bi-based brazing material disposed on other surface of the core material, contains, by mass %, Si: 6.0% to 14.0%, Mg: 0.05% to 1.5%, Bi: 0.05% to 0.25%, Sr: 0.0001% to 0.1%, and a balance consisting of Al and inevitable impurities, and satisfies a relationship of (Bi+Mg)×Sr≤0.1 by mass %, in which Mg—Bi-based compounds contained in the Al—Si—Mg—Bi-based brazing material with a diameter of 0.1 μm or more and less than 5.0 μm are more than 20 in number per 10,000-μm.sup.2 and the Mg—Bi-based compounds with a diameter of 5.0 μm or more are less than 2 in number, and the core material contains Mn: 0.9% to 1.7%, Si: 0.2% to 1.0%, Fe: 0.1% to 0.5%, Cu: 0.08% to 1.0%, and a balance consisting of Al and inevitable impurities.

An Al—Si—Mg—Bi-based brazing material containing Si: 6.0% to 14.0%, Fe: 0.05% to 0.3%, Mg: 0.02% to 1.5%, Bi: 0.05% to 0.25%, Sr: 0.0001% to 0.1%, and a balance of Al and inevitable impurities, and satisfies (Bi+Mg)×Sr≤0.1, is disposed on both surfaces of a core material, Mg—Bi-based compounds of the brazing material with a diameter of 0.1 μm or more and less than 5.0 μm in terms of equivalent circle diameter are more than 20 in number in 10,000 μm.sup.2 and the Mg—Bi-based compounds with diameter of 5.0 μm or more are less than 2 in number in 10,000 μm.sup.2, the core material contains Mn: 0.8% to 1.8%, Si: 0.01% to 1.0%, Fe: 0.1% to 0.5%, and a balance of Al and inevitable impurities, and a cathode current density of a brazing material layer after a brazing heat treatment is 0.1 mA/cm.sup.2 or less.