A solder alloy having an alloy composition including at least one of As: 25 to 300 mass ppm, Pb: more than 0 mass ppm and 5100 mass ppm or less, and Sb: more than 0 mass ppm and 3000 mass ppm or less, and moreover Bi: more than 0 mass ppm and 10000 mass ppm or less, as well as a balance including Sn, wherein expression (1) and expression (2) below are satisfied:

275≤2As+Sb+Bi+Pb  (1)

0.01≤(2As+Sb)/(Bi+Pb)≤10.00  (2) where in the expression (1) and the expression (2), As, Sb, Bi, and Pb each represent a content (mass ppm) in the alloy composition.

A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 μm to 30 μm; and the C.V. value of the solder particles is 20% or less.

A semiconductor device includes a semiconductor chip made of a SiC substrate and having main electrodes on one surface and a rear surface, first and second heat sinks, respectively, disposed adjacent to the one surface and the rear surface, a terminal member interposed between the second heat sink and the semiconductor chip, and a plurality of bonding members disposed between the main electrodes, the first and second heat sinks, and the terminal member. The terminal member includes plural types of metal layers symmetrically layered in the plate thickness direction. The terminal member as a whole has a coefficient of linear expansion at least in a direction orthogonal to the plate thickness direction in a range larger than that of the semiconductor chip and smaller than that of the second heat sink.

A conductive path can be formed using metal material coated with a layer that is controllably activated to release the metal material downhole in the wellbore. The conductive path can be used to communicate signals or power downhole in the wellbore.

Various implementations include a method of coupling a wire to conductive fabric. The method includes providing a conductive fabric, placing low-temperature solder in contact with a portion of the conductive fabric wherein the low-temperature solder has a liquidus temperature and a solidus temperature, placing a wire in contact with the low-temperature solder, increasing the temperature of the low-temperature solder to the liquidus temperature, and decreasing the temperature of the low-temperature solder to the solidus temperature. In some implementations, the low-temperature solder has a preformed shape corresponding to a surface of a portion of a wire, and the surface of the wire is placed in contact with the low-temperature solder.

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.

A solder paste containing a solder powder and a flux, in which the flux contains a keto acid and a hydroxy group-containing compound different from the keto acid, and the keto acid has a melting point of 60° C. or lower, the hydroxy group-containing compound has a melting point of 60° C. or lower and has at least three hydroxy groups in the molecule, and a content of the keto acid, a content of the hydroxy group-containing compound and a content of the solder powder satisfy Expressions (1) and (2),

W.sub.1×⅓≤W.sub.2≤W.sub.1×⅚  (1)

(W.sub.1+W.sub.2)/W.sub.3×100≥2.0  (2) where W.sub.1 represents a weight (g) of the keto acid, W.sub.2 represents a weight (g) of the hydroxy group-containing compound, and W.sub.3 represents a weight (g) of the solder powder.

A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.

Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.