The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

According to one embodiment, a metallic particle paste includes a polar solvent and particles dispersed in the polar solvent and containing a first metal. A second metal different from the first metal is dissolved in the polar solvent.

A tube for a heat exchanger including a tube structure made of lightweight metal alloy and having an inner surface and an outer surface. The tube further includes: a first layer of material on the outer surface of the tube structure, the first layer having different chemical composition than the tube structure, a second layer of material on the first layer of material, the second layer having different chemical composition than the tube structure and the first layer. The first layer includes metallic material having a lower galvanic potential than the tube structure. The first layer includes the deposition of zinc particles within the first layer. The deposition of zinc is not less than 3 g/m.sup.2 and not more than 7 g/m.sup.2. The second layer includes an aluminum silicon compound. The deposition of aluminum silicon compound within the second layer is not less than 14 g/m.sup.2 and not more than 16 g/m.sup.2.

Method and apparatus for establishing an electrical interconnection between an electrical lead and a printed circuit board (PCB), such as a PCB used in a data storage device. In some embodiments, the PCB includes a multi-layer substrate having at least one conductive layer and at least one electrically insulative layer. An electrically conductive pad is provided on a facing surface of the substrate in electrical communication with the at least one conductive layer. A flux reservoir is placed adjacent the pad which extends from the facing surface into the substrate. A solder mask layer is provided on the facing surface of the base structure which surrounds the pad and extends into the reservoir. The solder mask layer and reservoir collect liquid flux from a soldering operation used to form a solder joint between the pad and a conductive lead of an electronic component.

Methods for joining a first blank and a second blank, at least one of the first and second blanks comprising at least a layer of aluminum or of an aluminum alloy or a layer of zinc or of a zinc alloy. The method comprises selecting a first portion of the first blank to be joined to the second blank, and selecting a second portion of the second blank to be joined to the first portion, and welding the first portion to the second portion. The welding comprises using a filler metal laser beam and a welding laser beam, and displacing both laser beams in a welding direction to melt and mix a filler wire material with the melted portions of the two blanks. The present disclosure further relates to blanks obtained by any of these methods and to products obtained from such blanks.

A heat transfer tube includes: a tube body made of an extruded material of an aluminum alloy having a composition including: 0.3 mass % or more and less than 0.8 mass % of Mn; more than 0.1 mass % and less than 0.32 mass % of Si; 0.3 mass % or less of Fe; 0.06 mass % or more and 0.3 mass % or less of Ti; and Al balance including inevitable impurities, a ratio of a Mn content to a Si content, Mn %/Si %, exceeding 2.5; and a Zn-containing layer provided to an outer surface of the tube body.

The present invention provides a brazing filler material in which the formation of coarse Si particles is suppressed, and a brazing sheet using the same. The brazing filler material includes Si: 3.5% by mass or more and 13.0% by mass or less, Ti: 0.001% by mass or more and 0.05% by mass or less, V: more than 0.0005% by mass and 0.05% by mass or less, and B: 0.001% by mass or less (excluding 0% by mass), with the balance being Al and inevitable impurities, and the value of V/Ti, which is a value obtained by dividing the V content (% by mass) by the Ti content (% by mass) is 0.05 or more and 5 or less.

An extruded heat transfer tube with an internal passage includes a tube body made of an extruded material of an aluminum alloy having a composition that includes 0.3 mass % or more and less than 0.8 mass % of Mn; more than 0.1 mass % and less than 0.32 mass % of Si; 0.3 mass % or less of Fe; 0.06 mass % or more and 0.3 mass % or less of Ti; and Al balance including inevitable impurities, a ratio of a Mn content to a Si content, Mn %/Si %, exceeding 2.5. The extruded heat transfer tube further includes a Zn-containing layer provided directly on an outer surface of the tube body.

A chip arrangement including a chip comprising a chip back side; a back side metallization on the chip back side, the back side metallization including a plurality of layers; a substrate comprising a surface with a metal layer; a zinc-based solder alloy configured to attach the back side metallization to the metal layer, the zinc-based solder alloy having by weight 8% to 20% aluminum, 0.5% to 20% magnesium, 0.5% to 20% gallium, and the balance zinc; wherein the metal layer is configured to provide a good wettability of the zinc-based solder alloy on the surface of the substrate. The plurality of layers may include one or more of a contact layer configured to contact a semiconductor material of the chip back side; a barrier layer; a solder reaction, and an oxidation protection layer configured to prevent oxidation of the solder reaction layer.

The present disclosure provides compositions and methods for forming three-dimensional structures atop substrates. These structures may be formed and processed so as to braze together two substrates. The structures may be controllably formed in three dimensions so as to accommodate virtually any substrate geometry or configuration. The structures may also be disposed so as to maintain spacing between two surfaces.