A multi-material component joined by a high entropy alloy is provided, as well as methods of making a multi-material component by joining dissimilar materials with high entropy alloys.

A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.

A method for manufacturing a metal-ceramic substrate (1) includes providing a ceramic layer (10), a metal layer (20) and a solder layer (30) coating the ceramic layer (10) and/or the metal layer (20) and/or the solder layer (30) with an active metal layer (40), arranging the solder layer (30) between the ceramic layer (10) and the metal layer (20) along a stacking direction (S), forming a solder system (35) comprising the solder layer and the active metal layer (40), wherein a solder material of the solder layer (30) is free of a melting point lowering material and bonding the metal layer (20) to the ceramic layer (10) via the solder system (35) by means of an active solder process.

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E-9 Ω*m to about 742.5×E-9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

Disclosed is a method for forming a hollow pipe-sandwiching metal plate and applications thereof. The hollow pipe-sandwiching metal plate comprises a first panel, a second panel, and multiple hollow pipes between the first panel and the second panel; gaps are arranged among the hollow pipes, and the hollow pipes are connected to the first panel and the second panel by brazing. The present disclosure further includes the applications of the hollow pipe-sandwiching metal plate. The hollow pipe-sandwiching metal plate has advantages, such as light weight, high strength, low stress, high temperature resistance, pressure bearing, thermal insulation and vibration isolation. The metal plate will not deform due to thermal difference, thereby providing permanent service life of the metal plate.

One object of the present invention is to provide a bonding material capable of forming a highly reliable bond, the present invention provides a bonding material having a plate shape or a sheet shape, wherein the bonding material includes: fine copper particles having an average particle diameter of 300 nm or less; coarse copper particles having an average particle diameter of 3 .Math.m or more and 11 .Math.m or less; and a reducing agent which reduces the fine copper particles and the coarse copper particles.

The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter Do made of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.

A bonded body according to an embodiment includes a ceramic substrate, a copper plate, and a bonding layer that is located on at least one surface of the ceramic substrate and bonds the ceramic substrate and the copper plate. The bonding layer includes titanium. The bonding layer includes first and second regions; the first region includes a layer including titanium as a major component; the layer is formed at an interface of the bonding layer with the ceramic substrate; and the second region is positioned between the first region and the copper plate. The bonded body has a ratio M1/M2 of a titanium concentration M1 at % in the first region and a titanium concentration M2 at % in the second region that is not less than 0.1 and not more than 5 when the Ti concentrations are measured by EDX respectively in measurement regions in the first and second regions.

An arc welding solid wire includes: a steel material; and a copper plating layer formed on a surface of the steel material, in which an amount of Cu in the steel material and the copper plating layer is 0.05 mass % to 0.30 mass % with respect to a total mass of the wire, a surface of the wire is coated with 0.05 g to 0.20 g of oil with respect to 1 kg of the wire, and on a surface of the copper plating layer, an arithmetic average roughness Rac in a circumferential direction is 0.25 .Math.m to 1.00 .Math.m, and an arithmetic average roughness Ral in a longitudinal direction is 0.07 .Math.m to 0.50 .Math.m.

Welding wires may include a high alloy metal core comprising greater than about 10.5 percent by weight of the high alloy metal core of a component selected from aluminum, bismuth, chromium, molybdenum, chromium/molybdenum alloy, cobalt, copper, manganese, nickel, silicon, titanium, tungsten, vanadium, or a combination thereof; and a layer surrounding the high alloy metal core, the layer comprising copper or a copper alloy. Welding methods may include applying an electrical current sufficient to convert a welding wire to a molten state to produce a molten weld material, the welding wire comprising: a high alloy metal core comprising greater than about 10.5% of a component selected from aluminum, bismuth, chromium, molybdenum, chromium/molybdenum alloy, cobalt, copper, manganese, nickel, silicon, titanium, tungsten, vanadium, or a combination thereof; and a layer surrounding the high alloy metal core, the layer comprising copper or a copper alloy; and depositing the molten welding material onto a workpiece.