Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.

The present disclosure relates to the technical field of dissimilar welding of Cu and a steel, and in particular to a welding wire for dissimilar welding of Cu and a steel and a preparation method thereof and a method for welding Cu and a steel. The present disclosure provides a welding wire for dissimilar welding of Cu and a steel, including, in percentages by mass, 5-25% of iron phase, less than 0.1% of inevitable impurities, and copper matrix. The welding wire of the present disclosure, containing two elements, i.e. copper and iron, is conducive to the mixing of the two phases—copper and iron—during the welding process, to form a mutual soluble region, thereby makes it possible to greatly increase the weldability, reduce the width of the weld, effectively overcome the tendency of cracks, and thus to ensure the formed weld with a high crack resistance.

Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

Proposed are a copper sintering paste composition and a method of preparing the same. The copper sintering paste composition can replace conventional bonding material such as solder and lead-free solder and has excellent heat resistance, heat-generating properties, thermal conductivity, and bonding strength.

Disclosed is a method for producing a high-temperature-resistant, lead-free solder joint between a circuit board and a part, wherein a lead-free solder preform is used that has a composite material having a first composite component arranged substantially in layers and wherein the part is soldered with the solder preform in a hot-bar selective soldering process. Also disclosed is a high-temperature-resistant, lead-free solder joint and a field device of automation technology for determining and/or monitoring the process variable of a medium with a high-temperature-resistant, lead-free solder joint.

Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

A metal composition that includes a first metal; and a second metal containing a first transition metal element added to a first alloy having a melting point higher than a melting point of the first metal, and the second metal is an alloy capable of producing an intermetallic compound with the first metal.

A process for the production of a crude solder composition includes the provision of a first solder refining slag that includes tin and/or lead. The process further includes the steps of partially reducing the first solder refining slag, thereby forming a crude solder metal composition and a second solder refining slag, followed by separating the second solder refining slag from the crude solder metal composition, and partially reducing the second solder refining slag, thereby forming a second lead-tin based metal composition and a second spent slag followed by separating the second spent slag from the second lead-tin based metal composition A copper containing fresh feed is added to step (ii), preferably before reducing the second solder refining slag.

The invention discloses an arrangement for mechanically and electrically contacting a glow wire of a thermal radiation source, comprising a glow wire made of refractory metal having at least one flat connection surface to be contacted, a contact surface on which the glow wire is contacted, and a contacting means which connects the glow wire to the contact surface. The invention also relates to a method for producing the contact according to the invention. The problem addressed by the invention, of providing a reliable and enduringly stable mechanical and electrical contact of glow wires made of refractory metals, is solved in that the flat connection surface has at least two perforations and/or at a circumferential edge of the connection surface of the glow wire at least two recesses are formed, wherein the contacting means is integrally connected to the contact surface at the location of the perforations and/or recesses and forms both an electrical and a mechanical connection to the glow wire at the location of the perforations and/or recesses by means of a flange-like design of the contacting means above the connection surface of the glow wire.

The electrode for welding sheets of steel or aluminum, with a conductivity greater than or equal to 90% IACS and made of an alloy including, by weight based on the total weight of the alloy, chromium in a proportion higher than or equal to 0.1% and lower than 0.4%, between 0.02 and 0.04% of zirconium, lower than 0.015% of phosphorus, the remainder being copper and less than 0.1% of unavoidable impurities. The electrode structure advantageously includes incoherent chromium precipitates, more than 90% of which have a projected surface area of less than 1 μm.sup.2, the precipitates having a size of between 10 and 50 nm. The electrode has a fiber structure of radial fibers, each fiber having a thickness of less than 1 mm and a substantially central fibreless region that has a diameter of less than 5 mm. The invention also relates to a method for producing the electrode.