Patent classifications
B23K35/3033
FUSED FILAMENT FABRICATION OF BRAZE ALLOYS
An additive manufacturing technique may include depositing, via a filament delivery device, a filament onto a surface of a substrate. The filament includes a binder and a powder including at least one metal or alloy and at least one braze alloy. The technique also includes sacrificing the binder to form a preform. The technique also includes sintering the preform to form a component including the at least one metal or alloy and the at least one braze alloy.
BRAZE JOINTS FOR A COMPONENT AND METHODS OF FORMING THE SAME
A system for creating a braze joint within a component. The system includes an environment operable to reach a braze temperature sufficient to melt at least a portion of a braze material. The system also includes a component within the environment, the component including a base having a base surface, a recess depending from the base surface into the base to an inner edge, and a braze material within the recess and forming a cap above the base surface. The braze material fills the recess from the cap to the inner edge. The cap has an exposed braze surface. The system also includes an insulation layer that at least partially covers the exposed braze surface.
TECHNIQUES AND ASSEMBLIES FOR JOINING COMPONENTS USING SOLID RETAINER MATERIALS
The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component. The techniques may also include inserting a solid retainer material into the joint region through an aperture in one of the first component or the second component to form a mechanical interlock between the first component and the second component and sealing the aperture to retain the solid retainer material within the joint region. The solid retainer material includes at least one of a metal, a metal alloy, or a ceramic.
LASER METAL DEPOSITION WITH CORED FILLER WIRE
A cored filler wire (10) used in a laser metal deposition (LMD) process and method of using the same. The cored filler wire includes an outer shell (12) surrounding an inner filler material (14). The outer shell is formed from a first material, e.g., a nickel based alloy having a low gamma prime content. The inner filler comprises at least a second material, e.g., a nickel based superalloy powder material comprising a gamma prime content higher than the first material. Upon laser processing, via LMD, and subsequent solidification, the resulting build-up layer (18) formed from the processed cored filler wire comprises an identical or near identical chemical composition to that of the underlying base material (5) or component being repaired.
Metal paste and thermoelectric module
The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.
Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devices
In described examples, a transient liquid phase (TLP) metal bonding material includes a first substrate and a base metal layer. The base metal layer is disposed over at least a portion of the first substrate. The base metal has a surface roughness (Ra) of between about 0.001 to 500 nm. Also, the TLP metal bonding material includes a first terminal metal layer that forms an external surface of the TLP metal bonding material. A metal fuse layer is positioned between the base metal layer and the first terminal metal layer. The TLP metal bonding material is stable at room temperature for at least a predetermined period of time.
Ni-based alloy core wire for covered electrode, covered electrode, and method of manufacturing covered electrode
A Ni-based alloy core wire for a covered electrode according to an aspect of the invention includes, as a chemical composition, by mass %: C: 0.0100% to 0.0800%; Si: 0.010% to 0.800%; Mn: 0.010% to 1.800%; Mo: 15.0% to 28.0%; W: 2.5% to 8.0%; Cu: 0.10% to 1.20%; Ta: 0.002% to 0.120%; Ni: 65.0% to 82.3%; and a remainder: impurities with other optional selective elements; in which a value X is 0.010% to 0.160%.
Composite welding rods and associated cladded articles
Welding rods and associated cladded articles are described herein. Briefly, a welding rod comprises a hard particle component dispersed in a nickel-based alloy matrix or cobalt-based alloy matrix, the hard particle component comprising tungsten carbide particles having an average size of less than 45 m, and the nickel-based alloy matrix or the cobalt-based alloy matrix comprising at least one metal carbide forming element.
Low-melting nickel-based alloys for braze joining
A braze alloy composition includes the formula:
Ni.sub.aFe.sub.bP.sub.cB.sub.dSi.sub.eC.sub.fX.sub.g wherein X is selected from the group consisting of Cu, Nb, Hf, Mo, W, V, Ta, Y, La, rare earth elements, Al, Ru, Pd, Cr, Mn, Co, Be, and mixtures thereof, a, b, c, d, e, f, and g are atom % of, respectively, Ni, Fe, P, B, Si, C, and X, and wherein 75((a+b)g)90, a>b, 10c+d+e+f25, and g<10.
Light emitting diode (LED) components including multiple LED dies that are attached to lead frames
A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.