B23K35/3033

SOLDER PASTE MISPRINT CLEANING
20170348785 · 2017-12-07 ·

A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Method for producing an axle housing of a vehicle axle, and axle housing of a vehicle axle

The invention relates to a method for producing an axle housing of a vehicle axle, by means of integrally connecting an axle tube (1) to an axle shaft (2) which is positioned on the longitudinal axis (L) of the axle tube, is equipped with bearing surfaces (3) for mounting a vehicle wheel, and has a tube cross-section facing said axle tube (1) which is substantially the same as the tube cross-section of the axle tube. In order to develop a welding method for the production of an axle housing that consists of an axle tube and an axle shaft secured thereto, which method is optimised in terms of the dynamic loads to which the axle housing is typically subjected in a driving operation, the method comprises the following steps: •—arranging the axle tube (1) and the axle shaft (2), with the abutting surfaces of their tube cross-sections positioned coaxially to one another, in a workpiece receiving portion of a welding installation (10), said welding installation additionally comprising an arc welding device (11) and a laser welding device (12) which is operated in parallel, •—continuously miming a weld seam (20) in the peripheral direction of the tube cross-sections, both welding devices (11, 12) being directed, actively and from the outside, onto substantially the same peripheral section of the abutting surfaces, wherein the laser beam (S) meets the outside (14) of the tube at right angles, and intersects the longitudinal axis (L) of the axle tube (1), and •—stopping running the weld seam (20) once this has passed over a peripheral angle of at least 360°. A corresponding axle housing is also disclosed.

LPS solder paste based low cost fine pitch pop interconnect solutions

Embodiments describe high aspect ratio and fine pitch interconnects for a semiconductor package, such as a package-on-package structure. In an embodiment, the interconnects are formed with a no-slump solder paste. In an embodiment, the no-slump solder paste is printed in an uncured state, and is then cured with a liquid phase sintering process. After being cured, the no-slump solder paste will not reflow at typical processing temperatures, such as those below approximately 400° C. According to embodiments, the no-slump solder paste includes Cu particles or spheres, a solder matrix component, a polymeric delivery vehicle, and a solvent. In an embodiment, the liquid phase sintering produces a shell of intermetallic compounds around the Cu spheres. In an embodiment, the sintering process builds a conductive metallic network through the no-slump solder paste.

Nickel-carbon and nickel-cobalt-carbon brazes and brazing processes for joining ceramics and metals and semiconductor processing and industrial equipment using same

A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.

METHOD FOR REPAIRING A COMPONENT
20170312867 · 2017-11-02 ·

A method for repairing a component is provided, including the following steps: introducing a recess into the component, via which recess a damaged region in the component is removed; positioning a filler body in the recess; and fixedly, i.e. non-detachably, connecting the filler body to the component, wherein the filler body is provisionally secured to the component prior to establishing the fixed connection to the component, in that a securing element is placed over the filler body and the securing element is attached to the component, wherein the securing element is removed again after the establishing of the fixed connection between the filler body and the component.

METHOD OF WELDING A NICKEL STRENGTH LUG WITH A BRONZE CONNECTING PIN AND A BRASS CONTACT RING IN AN ACCELEROMETER SENSOR
20170312847 · 2017-11-02 ·

The present invention consists in a method of welding a nickel strength lug with a bronze connecting pin and a brass contact ring in an accelerometer sensor, the strength lug being interleaved between the connecting pin and the contact ring, the welding being effected electrically with the strength lug pressed simultaneously against the connecting pin and the contact ring. Before welding, the strength lug undergoes deformation of its external surface at least on each of two portions of the surface respectively facing the connecting pin and the contact ring, the surface deformation creating on each of the portions asperities intended to come into local contact with the connecting pin and the contact ring, respectively.

Low melting point braze alloy for high temperature applications
09802278 · 2017-10-31 · ·

A multi component braze filler alloy is described having a melting temperature less than about 1235 deg. C. and greater than about 1150 deg. C. This alloy can be processed by hot isostatic pressing (HIP) at a temperature above about 1065 deg. C. and is particularly suited for the repair of gas turbine blades and vanes, especially those made from Alloy 247. The relatively low Ti content in the present braze alloy tends to form less MC carbides at the joint interface, particularly in comparison with other braze alloys high in Zr and/or Hf. Processes for employing this braze filler alloy in processing of nickel-base superalloys, especially Alloy 247, are presented.

High temperature electrochemical cell structures, and methods for making

An electrochemical cell is described, including an anodic chamber and a cathodic chamber separated by an electrolyte separator tube, all contained within a cell case. The cell also includes an electrically insulating ceramic collar positioned at an opening of the cathodic chamber, and defining an aperture in communication with the opening; along with a cathode current collector assembly; and at least one metallic ring that has a coefficient of thermal expansion (CTE) in the range of about 3 to about 7.5 ppm/° C., contacting at least a portion of a metallic component within the cell, and an adjacent ceramic component. An active braze alloy composition attaches and hermetically seals the ring to the metallic component and the collar. Sodium metal halide batteries that contain this type of cell are also described, along with methods for sealing structures within the cell.

FCC MATERIALS OF ALUMINUM, COBALT AND NICKEL, AND PRODUCTS MADE THEREFROM
20170306459 · 2017-10-26 ·

The present disclosure relates to new materials comprising Al, Co, and Ni. The new materials may realize a single phase field of a face-centered cubic (fcc) solid solution structure immediately below the solidus temperature of the material. The new materials may include at least one precipitate phase and have a solvus temperature of at least 1000° C. The new materials may include 6.7-11.4 wt. % Al, 5.0-48.0 wt. % Co, and 43.9-88.3 wt. % Ni. In one embodiment, the precipitate is selected from the group consisting of the L1.sub.2 phase, the B2 phase, and combinations thereof. The new alloys may realize improved high temperature properties.

FCC MATERIALS OF ALUMINUM, COBALT, CHROMIUM, AND NICKEL, AND PRODUCTS MADE THEREFROM
20170306460 · 2017-10-26 ·

The present disclosure relates to new materials comprising Al, Co, Cr, and Ni. The new materials may realize a single phase field of a face-centered cubic (fcc) solid solution structure immediately below the solidus temperature of the material. The new materials may include at least one precipitate phase and have a solvus temperature of at least 1000° C. The new materials may include 2.2-8.6 wt. % Al, 4.9-65.0 wt. % Co, 4.3-42.0 wt. % Cr, and 4.8-88.6 wt. % Ni. In one embodiment, the precipitate is selected from the group consisting of the L1.sub.2 phase, the B2 phase, the sigma phase, the bcc phase, and combinations thereof. The new alloys may realize improved high temperature properties.