A solder composition contains: a flux composition containing an (A) rosin resin, a (B) activator, a (C) thixotropic agent, and a (D) solvent; and (E) solder powder, in which the (B) component contains a (B1) dicarboxylic acid having 3 to 8 carbon atoms, the (C) component contains at least one selected from the group consisting of a (C1) amide thixotropic agent having a hydroxy group in one molecule and a (C2) glycerol thixotropic agent having a hydroxy group in one molecule, and the solder composition satisfies a condition represented by Numerical Formula (F1) below provided that a total of contents of the (C1) component and the (C2) component is defined as X and a content of the (B1) component is defined as Y,

[00001]$\text{X}\text{}/\text{}2\le \text{Y}\le 5\text{X}$

A feedstock for an additive manufacturing process includes a pre-ceramic polymer intermixed with a base material. A method of additive manufacturing includes melting and pyrolizing a feedstock containing metal and a pre-ceramic polymer. An article of manufacture includes an additive manufacturing component including a pyrolized feedstock.

A flux containing an organic acid, an acrylic resin, a rosin, a thixotropic agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid, and the content of the 1,2,3-propanetricarboxylic acid is 0.1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced, temperature cycle reliability is excellent, and scattering due to heating during reflow can be suppressed.

A solder paste is adopted, the solder paste containing: a solder alloy powder in which a content of solder alloy particles having a particle size of 8 μm or less is 99% by mass or more with respect to a total mass of the solder alloy powder; and a flux. This flux contains an acid-modified rosin, a solvent, an activator, and a thixotropic agent, in which the activator contains a halogenated aliphatic compound, and a dicarboxylic acid represented by General Formula (2).

##STR00001##

[in the formula, R represents an alkylene group having 1 to 7 carbon atoms, or a single bond, provided that a methylene group constituting the alkylene group may be substituted with an oxygen atom]

A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.

A solder paste includes a solder powder and a flux. The flux includes a rosin, an activator, a solvent, and a thixotropic agent containing a polyethylene glycol. A content of the polyethylene glycol is 10 mass % to 20 mass % with respect to a total mass of the flux, a content of the thixotropic agent excluding the polyethylene glycol is 5 mass % or less with respect to the total mass of the flux, and a content of the rosin is more than 15 mass % and 50 mass % or less with respect to the total mass of the flux.

Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.

A flux for a solder paste includes rosin, an activator and a solvent. The solvent includes a monoalkylene glycol-based solvent and a solid solvent that is solid at 20° C. The total content of the monoalkylene glycol-based solvent and the solid solvent ranges from 40% by mass to 60% by mass with the total amount of the flux as 100%. The content of the solid solvent ranges from 5% by mass to 25% by mass with the total amount of the flux as 100%.

A Magnetic-field melting preform solder that melts by action of an AC magnetic field, wherein the preform solder includes a laminated structure made up of two or more layers, at least two layers constituting the laminated structure is made up of solder material, the at least two layers do not contain ferromagnetic material, each of the at least two layers includes a surface facing with each other, and the surfaces facing with each other are in contact with each other. A bonding method using the preform solder includes a providing the preform solder between an electrode on a substrate and an electrode of an electronic component, and bonding together the electrode on the substrate and the electrode of the electronic component by generating an AC magnetic field around the substrate and thereby melting the preform solder.

A coating composition for a heat exchanger tube including vanadium (V), a flux, and a binder, wherein the vanadium is included in an amount of 28 to 38 parts by weight with respect to 100 parts by weight of the composition, and a coating method of a heat exchanger tube using the same are provided.