Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 μm as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2θ=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2θ=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C., 60 minutes) of the silver particles is designated as S2, the value of S2/S1 is adjusted to a value within the range of 0.2 to 0.8.

There is provided a compression-bonded magnet with a case, which can realize high magnetic properties, high corrosion resistance and high durability strength even at low cost. The compression-bonded magnet with a case is a compression-bonded magnet with a case 1, comprising: a compression-bonded magnet 2 comprising a rare earth magnet powder such as an isotropic Nd—Fe—B magnet powder and a resin binder of a thermosetting resin; a case 3 for inserting the compression-bonded magnet 2; and a sealing member 4, wherein the compression-bonded magnet 2 is formed by compression-molding a mixture comprising the rare earth magnet powder and the resin binder into a green compact and curing the resin binder contained in the green compact, the rare earth magnet powder is contained in a large amount with respect to the entire compression-bonded magnet (for example, in a volume ratio of 85% to 90%), the sealing member 4 is fixed at an insertion opening part 3a of the case 3, and the compression-bonded magnet 2 is hermetically sealed by the sealing member 4 and the case 3.

Provided is a flux for soldering that can suppress a crack in a flux residue even if the flux for soldering is exposed to a cooling and heating cycle at the highest temperature of 150° C. such as the inside of an engine room of automobiles for a long period of time, and a soldering paste composition including the flux for soldering. The flux for soldering includes a synthetic resin, an activator, an organic solvent, and a thixotropic agent, in which synthetic resin contains a triblock copolymer of methacrylic acid ester with acrylic acid ester configured of a linear alkyl moiety having 3 to 6 carbon atoms. In addition, a soldering paste composition including the flux for soldering is used.

Provided is a wire for electric bonding, which includes a solder wire and a composition for bonding adjacent to the solder wire, the solder wire is wet when reaches to a melting point as heat is transferred, the composition for bonding includes an epoxy resin, a reducing agent, and a curing agent, the reducing agent removes a metal oxide formed on a surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature.

A flux comprising an organic acid; a solvent; and polyoxyethylene behenyl alcohol having an average number of moles of ethylene oxide added of 7 to 40 mol.

A flux according to the present invention contains a rosin methyl ester in which the flux is a solid or solid-like flux at 25° C., and is used for an inside of a flux-cored solder or an exterior of a flux-coated solder.

The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 μm or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

A method of ultrasonic additive manufacturing comprising using ultrasonic additive manufacturing to build a solid metal object through ultrasonically welding successive layers of thin metal foil into a three-dimensional shape; machining internal features into the solid metal object, wherein the internal features include voids, chambers, cavities, channels, or conduits; depositing a sacrificial support material in the internal features, wherein the sacrificial support material includes at least one water-soluble solid, and at least one water-soluble binding agent; curing the sacrificial support material at a predetermined temperature for a predetermined period of time within the internal features; using ultrasonic additive manufacturing to deposit additional successive layers of metal on top of the sacrificial material and solid metal object to complete the solid metal object; and introducing a solution containing water into the internal features to dissolve and remove the sacrificial support material therefrom.

A bonding and sealing material includes, as the essential ingredients, a solder powder, silver nanoparticles coated with a coating material and a solvent, and additionally includes at least one ingredient selected from the group consisting of selenium metal, oxide film inhibitors and oxide film removers. This bonding and sealing material can easily form under mild conditions a metallic adhesive layer having good hermetic sealability and UV resistance of the sort desired when sealing a short-wavelength light-emitting device such as a UV-LED, and can be stably used over a long period of time.

The present invention employs a flux-coated ball 100 having a core part 110 and a shell part 120 with which the core part 110 is coated. The flux-coated ball 100 is characterized in that the core part 110 is made of a solder ball or a copper core ball, that the shell part 120 is made of a flux layer containing at least one selected from the group consisting of an activator and a resin component, and that an oxide film thickness in the flux-coated ball 100 is 3 nm or less.