A solder composition of the invention contains: a flux composition containing (A) a rosin resin, (B) an activator, (C) an imidazoline compound having a phenyl group, and (D) an antioxidant; and (E) solder powder, in which the (B) component contains (B1) an organic acid, the (B1) component contains at least one selected from the group consisting of (B11) 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 1,4-dihydroxy-2-naphthoic acid, and the (C) component is at least one selected from the group consisting of 2-phenylimidazoline and 2-benzylimidazoline.

A flux paste composition including one or more fluoroaluminate based flux agents, one or more thickening agents, a carrier, a dispersant, a wetting agent, a defoamer, a moderator, and a biocide agent. The flux past composition can be blended with one or more rheological additives selected based upon printing the blended flux composition by a contactless inkjet printing system.

The present invention discloses a method for manufacturing an insulated spherical weld gold wire for integrated circuit double-layer stacked package, which relates to the technical field of microelectronic packaging spherical weld gold wires, and specifically comprises the following steps: alloy sheet preparation; alloy rod preparation; stretching; annealing treatment; activation treatment; sputtered insulating coating; multi-winding and sub-packaging, since the polyaryletherketone insulating coating is provided on the surface of the spherical weld gold wire in a scaled integrated circuit and the double-layer stacked package of the present invention, the spherical weld gold wire is allowed to contact and cross during packaging, without affecting the product performance, cost and quality; two high-hardness and high-conductivity materials of cobalt and germanium are added, which greatly enhances the tensile strength of the material.

Proposed are a copper sintering paste composition and a method of preparing the same. The copper sintering paste composition can replace conventional bonding material such as solder and lead-free solder and has excellent heat resistance, heat-generating properties, thermal conductivity, and bonding strength.

Provided are a resin composition and a soldering flux. The resin composition includes at least one acid and rosin. The acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by hydrogenating a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by hydrogenating a trimer acid which is a reaction product of oleic acid and linoleic acid. A weight ratio of the at least one acid to the rosin is 0.15 or more and 1.00 or less based on the weight of the rosin. The soldering flux is obtained by diluting the resin composition with a solvent.

Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.

A flux according to the present invention is a halogen-free flux used for soldering that includes: a thixotropic agent a polyamide compound in which one endothermic peak or all of endothermic peaks obtained by differential thermal analysis are observed within a range of 130 to 200° C.; and an activator comprising an isocyanuric acid derivative, in which a content of the isocyanuric acid derivative is 5.0 mass % or less based on the entire flux.

A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.

A solder paste including at least two types of solder powders each containing at least two types of metal elements has an average free energy of oxide formation of the at least two types of solder powders on a molar basis of −490 kJ/mol or more, the average free energy of oxide formation being a sum of products (A.sub.i×B.sub.i) of a molar ratio (A.sub.i) of each of the at least two types of metal elements (i) based on all the at least two types of metal elements constituting the at least two types of solder powders included in the solder paste and a free energy (B.sub.i kJ/mol) of oxide formation of the each of the at least two types of metal elements, and an average melting point of the at least two types of solder powders on a mass basis of 121° C. or lower, the average melting point being a sum of products (C.sub.j×D.sub.j) of a mass ratio (C.sub.j) of each of the at least two types of solder powders (j) based on a total mass of the at least two types of solder powders included in the solder paste and a melting point (D.sub.j° C.) of the each of the at least two types of solder powders.