A solder composition comprising a material in a first phase (e.g., liquid and/or solid phase) with a transition temperature is provided. Exposure of the solder to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change from the first phase to a gaseous phase. The phase change physically transforms the solder material.

A flux contains: a triol solvent (S1); a monoamide-based thixotropic agent; and at least one solvent (S2) selected from the group consisting of a monohydric solvent and a dihydric solvent, wherein the content of the monoamide-based thixotropic agent is 0.5% by mass or more and less than 15% by mass with respect to the total mass of the flux, and the content of the solvent (S2) is 50% by mass or more with respect to the total mass of the flux.

Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.

A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus. Rupture of the isolating structure results in an exothermic reaction between the first reactant and the second reactant. The exothermic reaction generates heat to volatilize the solvent carrier

The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10 C. per minute becomes zero, of from 180 C. to lower than 260 C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10 C. per minute becomes zero, of from 100 C. to lower than 220 C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.

Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.

Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

In one aspect of the present invention, a solder paste for connection pins is provided, comprising: solder powder that includes tin, has a mean diameter of 35 m, and wherein the proportion of powder particles with a diameter of 8 m or more is less than 1 wt %; and a flux that enhances the wettability of the aforementioned solder powder.

Provided herein is a flux which contains a rosin, a rosin amine; one or more types of organic sulfonic acid selected from the group consisting of an alkane sulfonic acid, an alkanol sulfonic acid, and an aromatic sulfonic acid, a thixotropic agent, and a solvent, wherein: the rosin content is 5-50 mass %, inclusive, of the total amount (100 mass %) of the flux, the rosin content is 5-30 mass %, inclusive, of the total amount (100 mass %) of the flux, the organic sulfonic acid content is 0.2-10 mass %, inclusive, of the total amount (100 mass %) of the flux, and the proportion (mass ratio) of the rosin amine content to the organic sulfonic acid content is 3.33-10, inclusive.

A nickel particle composition is shown, including: A) a nickel particle having an average particle size in the range of 0.5 m to 20 m obtained via a laser diffraction/scattering method and containing 50 wt % or more of a nickel element; B) a nickel fine particle having an average primary particle size in the range of 30 nm to 200 nm observed via a scanning electron microscope and containing 50 wt % or more of a nickel element; and C) an organic binder in the range of 0.1 wt % to 2.5 wt % relative to the total metal content; and the weight ratio of a component A to a component B (component A:component B) is in the range of 30:70 to 70:30.