A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.

A flux which imparts thixotropy, and which exhibits excellent printability, printing sagging-inhibiting ability, and heating sagging-inhibiting ability; and a solder paste which uses said flux. This flux includes a thixotropic agent, a rosin, an organic acid, and a solvent. The thixotropic agent includes a cyclic amide compound obtained by polycondensing a dicarboxylic acid and/or a tricarboxylic acid, and a diamine and/or a triamine into a cyclic shape; and an acyclic amide compound which is obtained by polycondensing a monocarboxylic acid, a dicarboxylic acid and/or a tricarboxylic acid into an acyclic shape. The flux includes at least 0.1 wt % but not more than 8.0 wt % of the cyclic amide compound, and at least 0.5 wt % but not more than 8.0 wt % of the acyclic amide compound. The total amount of the cyclic amide compound and the acyclic amide compound is at least 1.5 wt % but not more than 10.0 wt %.

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

The invention relates generally to welding and, more specifically, to corrosion resistant weld deposits created during arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). A disclosed corrosion resistant weld deposit comprises nickel, chromium, and copper, and has a low porosity.

A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.

The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 μm. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.

Provided is flux for resin flux cored solder using in a soldering method in which the resin flux cored solder is supplied into a through hole formed along a central axis of a soldering iron. The flux contains volatile rosin in an amount of 70 wt % or more and 98 wt % or less, non-volatile rosin in an amount of 0 wt % or more and 10% or less, and an activator in an amount of 2 wt % or more and 30 wt % or less, the activator including an organic acid in an amount of 0 wt % or more and 15 wt % or less, an organohalogen compound in an amount of 0.5 wt % and 15 wt % or less, an amine in an amount of 0 wt % or more and 5 wt % or less, and an amine hydrohalide salt in an amount of 0 wt % or more and 2.5 wt % or less.

A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

Thermally conductive adhesive materials having a first metallic component with a high melting point metal; a second metallic component having a low melting point metal; a fatty acid, an optional amine, an optional triglyceride and optional additives. Also provided are methods of making the same and uses thereof for adhering electronic components to substrates.