Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.

To provide a work processing apparatus equipped with a vaporizer that requires no carrier gas and can vaporize a vaporization target liquid having a relatively high flow rate, and a method for manufacturing a processed work. A vaporizer 1 includes a vaporization part 10 including a heat storage body 11 having a heat capacity higher than that of a vaporization target liquid Fq by a predetermined ratio, and a heat supplier 20 for supplying heat to the vaporization part 10. The predetermined ratio is a ratio of heat capacity at which a temperature drop of the heat storage body 11 by heat transfer from the heat storage body 11 to the liquid Fq flowing through a path 12 is within a predetermined range, wherein the amount of heat transferred from the heat storage body 11 to the liquid Fq is an amount of heat necessary to vaporize the liquid Fq at a planned proportion. A work processing apparatus 100 includes the vaporizer 1, a chamber 5, and a vacuum pump 6 for creating a negative pressure in the chamber 5. The method of manufacturing a processed work includes taking the work W into the chamber 5, supplying a processing gas Fg generated in the vaporizer 1 into the chamber 5, and performing predetermined processing on the work W under an atmosphere of the processing gas Fg in the chamber 5.

It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

A flux includes: at least one liquid solvent that has one or more hydroxy groups and is liquid at ordinary temperature; and at least two solid solvents that respectively have one or more hydroxy groups and are solid at normal temperature, in which the content of each of the solid solvents is less than 40 mass % based on the total content of the liquid solvent and the solid solvents.

Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 m to 0.8 m, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.

An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.

To provide a work processing apparatus equipped with a vaporizer that requires no carrier gas and can vaporize a vaporization target liquid having a relatively high flow rate, and a method for manufacturing a processed work. A vaporizer 1 includes a vaporization part 10 including a heat storage body 11 having a heat capacity higher than that of a vaporization target liquid Fq by a predetermined ratio, and a heat supplier 20 for supplying heat to the vaporization part 10. The predetermined ratio is a ratio of heat capacity at which a temperature drop of the heat storage body 11 by heat transfer from the heat storage body 11 to the liquid Fq flowing through a path 12 is within a predetermined range, wherein the amount of heat transferred from the heat storage body 11 to the liquid Fq is an amount of heat necessary to vaporize the liquid Fq at a planned proportion. A work processing apparatus 100 includes the vaporizer 1, a chamber 5, and a vacuum pump 6 for creating a negative pressure in the chamber 5. The method of manufacturing a processed work includes taking the work W into the chamber 5, supplying a processing gas Fg generated in the vaporizer 1 into the chamber 5, and performing predetermined processing on the work W under an atmosphere of the processing gas Fg in the chamber 5.

A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.