Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

A flux including: a) a phenolic activator except a hindered phenol, b) a resin, c) an organic acid, and d) a solvent. The phenolic activator, which is contained in the flux, has a molecular weight of 150 or more and 550 or less. Further, the flux may include: a) a phenolic activator except a hindered phenol and b) an acrylic resin.

A flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant and 5 to 60 wt % of a nonionic surfactant. A solder paste contains a flux containing 0.1 to 20 wt % of 2-hydroxyisobutyric acid as an activator, 10 to 60 wt % of a cationic surfactant, and 5 to 60 wt % of a nonionic surfactant and a metal powder.

There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

This disclosure relates generally to welding and, more specifically, to electrodes for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW) of zinc-coated workpieces. In an embodiment, a welding consumable for welding a zinc-coated steel workpiece includes a zinc (Zn) content between approximately 0.01 wt % and approximately 4 wt %, based on the weight of the welding consumable. It is presently recognized that intentionally including Zn in welding wires for welding galvanized workpieces unexpectedly and counterintuitively alleviates spatter and porosity problems that are caused by the Zn coating of the galvanized workpieces.

This metal paste for bonding includes a metal powder, a copper salt, an amine, and an alcohol, in which a ratio A/B of a weight A of Cu in the copper salt to a weight B of the metal powder is set to be in a range of 0.02 or more and 0.25 or less, the metal paste is in a paste form in a temperature range of 15? C. or higher and 35? C. or lower, a liquid phase is generated in a temperature raising process starting from 35? C., the liquid phase dissipates in the temperature raising process at a liquid phase generation temperature or higher, and a metal sintered body is formed at a liquid phase dissipation temperature or higher.

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

Provided is a flux for solder paste including an organic component as a main component, which is composed of a fatty acid and an aliphatic primary amine.

A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the total amount of the flux, the dicarboxylic acid content is 6 mass % or more and 25 mass % or less, and the iodine content is 200 ppm or more and 3600 ppm or less.