Disclosed are a substrate processing apparatus and a substrate processing method capable of improving processing uniformity of a substrate. The substrate processing apparatus includes a body configured to spin-rotate; a plurality of support pins installed on the body so as to support the substrate thereon; a plurality of chuck pins installed on the body so as to grip a side surface of the substrate; a chuck pin driver device configured to move the chuck pin from a stand-by position to a grip position when the substrate has been seated on the support pin; and a support pin spacing device configured to space the substrate and at least one of the support pins from each other while the chuck pin is gripping the substrate.

The present application discloses a flexible clamping device. A sleeve is fixed on a base, an adjusting shaft is connected with a mandrel and the sleeve respectively, the mandrel is fixed on the upper end face of the adjusting shaft, and the bottom outer wall of the adjusting shaft is in small clearance fit with the inner wall of the sleeve; a lock screw is installed on the upper right side wall of the sleeve, a pinion is installed on the upper left side wall of the sleeve via a rotating shaft, saw teeth are provided on the side wall of a floating shaft, and the pinion can be engaged with the side teeth of the floating shaft.