An OGS substrate and a grinding method thereof are provided. The OGS substrate includes a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

An OGS substrate and a grinding method thereof are provided. The OGS substrate includes a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

An OGS substrate and a grinding method thereof are provided. The OGS substrate includes a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

An intelligent polishing system provides improvements to the polisher itself as well as networking capability enabling remote control and monitoring of multiple polishers. One or more electronic devices ensure that a user of the intelligent polisher operates the polisher to achieve optimum results. Such devices may include a polishing timer, a downward pressure sensor, or a tachometer to measure speed. The system may further include a memory for storing operational parameters or performance characteristics of the intelligent polisher for later downloading or retrieval. The same or a different memory may store calibration information to ensure that intelligent polisher operates within predetermined limits. Such operational parameters, performance characteristics or calibration information include RPM, polishing time, downward force or inlet air pressure. The system may further include a plurality of intelligent polishers, each in communication with a server enabling remote monitoring or control of the polishers through a computer or mobile device.

An intelligent polishing system provides improvements to the polisher itself as well as networking capability enabling remote control and monitoring of multiple polishers. One or more electronic devices ensure that a user of the intelligent polisher operates the polisher to achieve optimum results. Such devices may include a polishing timer, a downward pressure sensor, or a tachometer to measure speed. The system may further include a memory for storing operational parameters or performance characteristics of the intelligent polisher for later downloading or retrieval. The same or a different memory may store calibration information to ensure that intelligent polisher operates within predetermined limits. Such operational parameters, performance characteristics or calibration information include RPM, polishing time, downward force or inlet air pressure. The system may further include a plurality of intelligent polishers, each in communication with a server enabling remote monitoring or control of the polishers through a computer or mobile device.

An intelligent polishing system provides improvements to the polisher itself as well as networking capability enabling remote control and monitoring of multiple polishers. One or more electronic devices ensure that a user of the intelligent polisher operates the polisher to achieve optimum results. Such devices may include a polishing timer, a downward pressure sensor, or a tachometer to measure speed. The system may further include a memory for storing operational parameters or performance characteristics of the intelligent polisher for later downloading or retrieval. The same or a different memory may store calibration information to ensure that intelligent polisher operates within predetermined limits. Such operational parameters, performance characteristics or calibration information include RPM, polishing time, downward force or inlet air pressure. The system may further include a plurality of intelligent polishers, each in communication with a server enabling remote monitoring or control of the polishers through a computer or mobile device.

A grinding method, an OGS substrate and a manufacturing method of an OGS mother substrate are provided. The grinding method is used to grind the OGS substrate comprising a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

A grinding method, an OGS substrate and a manufacturing method of an OGS mother substrate are provided. The grinding method is used to grind the OGS substrate comprising a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.