A method of processing a superabrasive element includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The polycrystalline diamond table includes a superabrasive face and a superabrasive side surface extending around an outer periphery of the superabrasive face. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table by (1) exposing at least a portion of the polycrystalline diamond table to a processing solution, (2) exposing an electrode to the processing solution, and (3) applying a charge to the electrode such that a voltage is generated between the polycrystalline diamond table and the electrode and the voltage is applied to the processing solution. The method includes the use of an improved processing solution, including an organic acid and a divalent (e.g., Group II) metal salt, to increase the leaching depth.

Embodiments of the invention relate to polycrystalline diamond compact (“PDC”) including a polycrystalline diamond (“PCD”) table that bonded to a cobalt-nickel alloy cemented carbide substrate. The cobalt-nickel alloy cemented carbide substrate provides both erosion resistance and corrosion resistance to the cemented carbide substrate. In an embodiment, a PDC includes a cemented carbide substrate including cobalt-nickel alloy cementing constituent. The PDC further includes a PCD table bonded to the cemented carbide substrate.

Embodiments of the invention relate to polycrystalline diamond compact (“PDC”) including a polycrystalline diamond (“PCD”) table that bonded to a cobalt-nickel alloy cemented carbide substrate. The cobalt-nickel alloy cemented carbide substrate provides both erosion resistance and corrosion resistance to the cemented carbide substrate. In an embodiment, a PDC includes a cemented carbide substrate including cobalt-nickel alloy cementing constituent. The PDC further includes a PCD table bonded to the cemented carbide substrate.

Embodiments of the invention relate to polycrystalline diamond compact (“PDC”) including a polycrystalline diamond (“PCD”) table that bonded to a cobalt-nickel alloy cemented carbide substrate. The cobalt-nickel alloy cemented carbide substrate provides both erosion resistance and corrosion resistance to the cemented carbide substrate. In an embodiment, a PDC includes a cemented carbide substrate including cobalt-nickel alloy cementing constituent. The PDC further includes a PCD table bonded to the cemented carbide substrate.

Embodiments of the invention relate to polycrystalline diamond compact (“PDC”) including a polycrystalline diamond (“PCD”) table that bonded to a cobalt-nickel alloy cemented carbide substrate. The cobalt-nickel alloy cemented carbide substrate provides both erosion resistance and corrosion resistance to the cemented carbide substrate. In an embodiment, a PDC includes a cemented carbide substrate including cobalt-nickel alloy cementing constituent. The PDC further includes a PCD table bonded to the cemented carbide substrate.

Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height “standing proud” above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.

Diamond-containing articles such as composite materials shaped as some specific article, can be engineered such that bodies that contact the article only contact diamond. In an embodiment, the article may be in the form of equipment for handling semiconductor wafers such as vacuum or electrostatic chucks. In one embodiment, the diamond-containing article can be a composite of diamond particulate reinforcing a Si/SiC body such as reaction-bonded SiC. Lapping the diamond-reinforced RBSC body with progressively finer diamond grit removes some of the SiC/Si matrix material, leaving diamond particles of uniform height “standing proud” above the rest of the surface of the formed article. Further, if the diamond-containing article is sufficiently electrically conductive, it may be machinable using electrical discharge machining.

A method of producing a free standing PCD comprises forming a mass of combined diamond particles and precursor compound(s) for the metals of the metallic network by suspending the diamond particles in a liquid, and crystallising and /or precip -itating the precursor compounds in the liquid. The mass is then removed from suspension by sedimentation and/or evaporation to form a dry powder of combined diamond particles and precursor compound(s). The powder is subjected to a heat treatment to disso -ciate and reduce the precursor compound(s) to form metal particles smaller in size than the diamond particles to provide a homogen -eous mass. This is then consolidated using isostatic compaction to form a homogeneous cohesive green body of a pre-selected size and 3-dimensional shape. The green body is subjected to high pressure and high temperature conditions such that the metallic mater -ial wholly or in part becomes molten and facilitates diamond particle to particle bonding via partial diamond re-crystallisation to form a free standing PCD body.

A method of producing a free standing PCD comprises forming a mass of combined diamond particles and precursor compound(s) for the metals of the metallic network by suspending the diamond particles in a liquid, and crystallising and /or precip -itating the precursor compounds in the liquid. The mass is then removed from suspension by sedimentation and/or evaporation to form a dry powder of combined diamond particles and precursor compound(s). The powder is subjected to a heat treatment to disso -ciate and reduce the precursor compound(s) to form metal particles smaller in size than the diamond particles to provide a homogen -eous mass. This is then consolidated using isostatic compaction to form a homogeneous cohesive green body of a pre-selected size and 3-dimensional shape. The green body is subjected to high pressure and high temperature conditions such that the metallic mater -ial wholly or in part becomes molten and facilitates diamond particle to particle bonding via partial diamond re-crystallisation to form a free standing PCD body.

Embodiments relate to polycrystalline diamond compacts (“PDCs”), methods of fabricating PDCs, and applications for such PDCs. In an embodiment, a method includes providing an at least partially leached polycrystalline diamond (“PCD”) body. A residual amount of acid may remain in and/or on the at least partially leached PCD body. The method further includes removing and/or neutralizing at least some of the residual amount of acid from the at least partially leached PCD body and/or a substrate to which the at least partially leached PCD body is attached.