A polishing pad (1) is provided with higher polishing efficiency for polishing an outer circumferential edge part (3d, 3e) of a disc-shaped wafer (3). An unpolished part is less likely to occur during a polishing process with the polishing pad (1), and the polished wafer (3) is cleanable easily. In the polishing pad (1), a polishing surface is formed of a polishing body, and the polishing body includes a base material and polishing particles. The base material is composed of a binder resin and fibers and has a plurality of pores formed therein. The polishing particles are retained in the base material or in the pores and are diamond particles. The polishing pad (1) has a durometer hardness in a range from 16 to 27, a density in a range from 0.58 to 0.81 g/cm.sup.3, and an elastic modulus in a range from 21.5 to 37.5 N/mm.sup.2.

A polishing pad (1) is provided with higher polishing efficiency for polishing an outer circumferential edge part (3d, 3e) of a disc-shaped wafer (3). An unpolished part is less likely to occur during a polishing process with the polishing pad (1), and the polished wafer (3) is cleanable easily. In the polishing pad (1), a polishing surface is formed of a polishing body, and the polishing body includes a base material and polishing particles. The base material is composed of a binder resin and fibers and has a plurality of pores formed therein. The polishing particles are retained in the base material or in the pores and are diamond particles. The polishing pad (1) has a durometer hardness in a range from 16 to 27, a density in a range from 0.58 to 0.81 g/cm.sup.3, and an elastic modulus in a range from 21.5 to 37.5 N/mm.sup.2.

This method for manufacturing a cutting blade includes: a mixing step of adding a liquid dispersion medium to a mixed powder containing a resin powder of a thermocompression-bondable resin, abrasive grains and fibrous fillers; a compression step of cold pressing, in a forming die, the mixed powder to which the dispersion medium has been added to form an original plate of a blade main body; and a sintering step of hot pressing and sintering the original plate.

This method for manufacturing a cutting blade includes: a mixing step of adding a liquid dispersion medium to a mixed powder containing a resin powder of a thermocompression-bondable resin, abrasive grains and fibrous fillers; a compression step of cold pressing, in a forming die, the mixed powder to which the dispersion medium has been added to form an original plate of a blade main body; and a sintering step of hot pressing and sintering the original plate.

The present invention includes methods and materials for cleaning materials, particles, or chemicals from a substrate with a brush or pad. The method comprising: engaging a surface of a rotating wafer with an outer circumferential surface of a rotating cylindrical foam roller, the cylindrical foam roller having a plurality of circumferentially and outwardly extending spaced apart nodules extending from the outer surface, each nodule defining a height extending from the outer surface of the cylindrical foam roller to a substrate engagement surface of the nodule, the substrate engagement surface of one or more of the nodules having a rounded configuration; and positioning the cylindrical foam roller on the substrate such that the one or more nodules are positioned to have only the rounded substrate engagement surface contact the substrate such that no linear surface of the one or more nodules contacts the substrate.

The present invention includes methods and materials for cleaning materials, particles, or chemicals from a substrate with a brush or pad. The method comprising: engaging a surface of a rotating wafer with an outer circumferential surface of a rotating cylindrical foam roller, the cylindrical foam roller having a plurality of circumferentially and outwardly extending spaced apart nodules extending from the outer surface, each nodule defining a height extending from the outer surface of the cylindrical foam roller to a substrate engagement surface of the nodule, the substrate engagement surface of one or more of the nodules having a rounded configuration; and positioning the cylindrical foam roller on the substrate such that the one or more nodules are positioned to have only the rounded substrate engagement surface contact the substrate such that no linear surface of the one or more nodules contacts the substrate.

The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

A polishing pad for surface planarization is made by impregnating a polyester-based fibrous fabric with thermosetting resins to form a porous impregnated material, and heating the porous impregnated material to effect changes in shape of the pores such that an integrally formed polishing pad with hard/soft layers of different hardnesses is obtained; the heated side of the polishing pad has high hardness and high cutting/grinding ability, whereas the unheated side maintains the original tiny pores and low hardness; and the polishing pad can produce a buffering effect when subjected to an external force and in turn apply an evenly distributed force to an article being polished.

The invention provides a chemical-mechanical polishing pad comprising a polymeric matrix and 0.1-15 wt. % of metal oxide particles. The polymeric matrix has pores, the metal oxide particles are uniformly distributed throughout the pores, and the metal oxide particles have a specific surface area of about 25 m.sup.2/g to about 450 m.sup.2/g. The invention further provides a method of polishing a substrate with the polishing pad.