B24D3/32

Abrasive wheels and methods for making and using same

A cutting wheel includes a body having a bond material. The bond material comprises at least about 31 vol % of a total volume of the body. Additionally, the body includes abrasive particles contained within the bond material. The abrasive particles include a first type of abrasive particle including black alumina with at least about 10 vol % of a total volume of the abrasive particles including black alumina. In some instances the cutting wheel can include a chop saw, while in other situations, the cutting wheel can include a cut-off wheel.

Abrasive wheels and methods for making and using same

A grinding tool includes a body having a first layer. The first layer can include bond material that is at least about 20 vol % of a total volume of the first layer. Additionally, the first layer can include abrasive particles contained within the bond material. In an embodiment, the abrasive particles include a first type of abrasive particle including black alumina with at least about 10 vol % of a total volume of the abrasive particles including black alumina. In some instances, the grinding tool can include a second layer that includes black alumina.

Abrasive wheels and methods for making and using same

A grinding tool includes a body having a first layer. The first layer can include bond material that is at least about 20 vol % of a total volume of the first layer. Additionally, the first layer can include abrasive particles contained within the bond material. In an embodiment, the abrasive particles include a first type of abrasive particle including black alumina with at least about 10 vol % of a total volume of the abrasive particles including black alumina. In some instances, the grinding tool can include a second layer that includes black alumina.

CMP POLISHING PAD

A polishing pad has a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity measured of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 or 15 to 30 micrometers. The polishing layer is chlorine free.

CMP POLISHING PAD

A polishing pad has a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity measured of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 or 15 to 30 micrometers. The polishing layer is chlorine free.

Polishing pad and method for making the same

The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.

Polishing pad and method for making the same

The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.

Coated abrasive article including a non-woven material

A coated abrasive article including a body having a backing including a spunlace polyester-based material and a saturant contained in the spunlace polyester-based material, the saturant including a material selected from the group of phenolic resin, acrylic, urea resin, and a combination thereof, and an abrasive layer overlying the backing including abrasive particles.

Coated abrasive article including a non-woven material

A coated abrasive article including a body having a backing including a spunlace polyester-based material and a saturant contained in the spunlace polyester-based material, the saturant including a material selected from the group of phenolic resin, acrylic, urea resin, and a combination thereof, and an abrasive layer overlying the backing including abrasive particles.

Polishing material for polishing hard surfaces, media including the material, and methods of forming and using same

Polishing materials suitable for polishing hard surfaces, media including the polishing material, and methods of forming and using the polishing materials and media are disclosed. Exemplary polishing materials have a relatively high hard segments:soft segments ratio and exhibit relatively high removal rates and/or relatively high process yields.