The invention refers to a double-sided polishing or sanding member (24) for releasable attachment to a hand-guided power tool (2). The polishing or sanding member (24) has an essentially disc-shaped form with an areal extension (26). A reinforcement plate (28) is located inside the polishing or sanding member (24) in the areal extension (26). The reinforcement plate (28) has a central attachment portion (30) for releasable attachment of the polishing or sanding member (24) to the power tool (2). It is suggested that the central attachment portion (30) comprises at least one magnetic element (32) adapted for interaction with at least one respective magnetic element (34) directly or indirectly attached to a tool shaft (14) of the power tool (2) in order to hold and secure the polishing or sanding member (24) in respect to the tool shaft (14).

The invention provides a porous polyurethane polishing pad that includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores extend to the top polishing surface and have lower and upper sections with a vertical orientation. The lower and upper sections are offset in a horizontal direction. Middle-sized pores with a columnar shape and a vertical orientation originate adjacent the middle sections and small pores with a columnar shape and a vertical orientation originate between the middle-sized pores. The pores combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing.

Various embodiments disclosed relate to pore inducers and porous abrasive forms made using the same. In various embodiments, the present invention provides a method of forming a porous abrasive form including heating an abrasive composition including pore inducers to form the porous abrasive form. During the heating the pore inducers in the porous abrasive form reduce in volume to form induced pores in the porous abrasive form.

Various embodiments disclosed relate to pore inducers and porous abrasive forms made using the same. In various embodiments, the present invention provides a method of forming a porous abrasive form including heating an abrasive composition including pore inducers to form the porous abrasive form. During the heating the pore inducers in the porous abrasive form reduce in volume to form induced pores in the porous abrasive form.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.

The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the composition comprising a first component comprising: one or more acrylate-blocked isocyanates, one or more acrylate monomers and at least one photoinitiator. The composition further comprising a second component comprising one or more amine curatives. The invention also provides a method of forming a chemical-mechanical polishing pad comprising preparing a composition comprising: a first component comprising one or more acrylate-blocked isocyanates, one or more acrylate monomers and at least one photoinitiator. The composition further comprising a second component comprising one or more amine curatives. The method further comprising exposing at least a layer of the composition to ultraviolet light, thereby initiating a polymerization reaction and thus forming at least a layer of solidified pad material; and heating the layer.

The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the composition comprising a first component comprising: one or more acrylate-blocked isocyanates, one or more acrylate monomers and at least one photoinitiator. The composition further comprising a second component comprising one or more amine curatives. The invention also provides a method of forming a chemical-mechanical polishing pad comprising preparing a composition comprising: a first component comprising one or more acrylate-blocked isocyanates, one or more acrylate monomers and at least one photoinitiator. The composition further comprising a second component comprising one or more amine curatives. The method further comprising exposing at least a layer of the composition to ultraviolet light, thereby initiating a polymerization reaction and thus forming at least a layer of solidified pad material; and heating the layer.

A grindstone that enables grinding, polishing, super-finish polishing by using the same grindstone, without clogging even if the grindstone is being used continuously, in which a grinding/polishing section for processing a workpiece has a honeycomb structure formed by arranging polygonal prisms with no clearance therebetween. The grindstone includes the grindstone columns consisting of abrasive grains and binder and having an axis in depth direction of grinding/polishing surface, which are disposed on intersections or wall portions of the honeycomb structure. Porous elastomer is disposed inside the honeycomb structure, thus making it possible to perform a super-finish polishing.

A grindstone that enables grinding, polishing, super-finish polishing by using the same grindstone, without clogging even if the grindstone is being used continuously, in which a grinding/polishing section for processing a workpiece has a honeycomb structure formed by arranging polygonal prisms with no clearance therebetween. The grindstone includes the grindstone columns consisting of abrasive grains and binder and having an axis in depth direction of grinding/polishing surface, which are disposed on intersections or wall portions of the honeycomb structure. Porous elastomer is disposed inside the honeycomb structure, thus making it possible to perform a super-finish polishing.

A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.