A molding device includes: a lower mold that supports a workpiece containing a thermoplastic resin and that is heated to a first predetermined temperature; an upper mold that is opposed to the lower mold, that presses the workpiece, and that is heated to a second predetermined temperature; a transferer that moves the lower mold and the upper mold relative to each other in a transfer direction of the workpiece; and control circuitry. The lower mold includes temperature-controlled regions adjacent to one another in the transfer direction, the temperature-controlled regions including a first lower mold temperature-controlled region and a second lower mold temperature-controlled region having a temperature lower than a temperature of the first lower mold temperature-controlled region. The control circuitry changes proportions of the first and second lower mold temperature-controlled regions in the lower mold as a function of a relative position between the upper and lower molds.

An imprint lithography apparatus having a first frame to be mounted on a floor, a second frame mounted on the first frame via a kinematic coupling, an alignment sensor mounted on the second frame, to align an imprint lithography template arrangement with a target portion of a substrate, and a position sensor to measure a position of the imprint lithography template arrangement and/or a substrate stage relative to the second frame.

An imprint lithography apparatus having a first frame to be mounted on a floor, a second frame mounted on the first frame via a kinematic coupling, an alignment sensor mounted on the second frame, to align an imprint lithography template arrangement with a target portion of a substrate, and a position sensor to measure a position of the imprint lithography template arrangement and/or a substrate stage relative to the second frame.

An imprint lithography apparatus having a first frame to be mounted on a floor, a second frame mounted on the first frame via a kinematic coupling, an alignment sensor mounted on the second frame, to align an imprint lithography template arrangement with a target portion of a substrate, and a position sensor to measure a position of the imprint lithography template arrangement and/or a substrate stage relative to the second frame.

A large area patterned film includes a first patterned area; a second patterned area; and a seam joining the first patterned area and the second patterned area, wherein the seam has a width less than about 20 micrometers. A method for tiling patterned areas includes depositing a predetermined thickness of a curable material; contacting a first portion of the curable material with a mold; curing the first portion of the curable material; removing the mold from the cured first portion of the curable material; contacting a second portion of the curable material with the mold, such that the mold contacts a portion of the cured first portion of the curable material; curing the second portion of the curable material; and removing the mold to yield a seam between the cured first portion of the curable material and the cured second portion of the curable material, wherein the seam has a dimension less than about 20 micrometers.

The invention relates to a method for producing an acoustic protection panel (1) for a motor vehicle, comprising a decoupling layer based on foam flakes (3) agglomerated by a heat-activatable binding agent (4), said binding agent being formed by binding fibres, said fibres comprising a core meltable at high temperature and a sheath meltable at lower temperature, said flakes being bound together by melting said sheath, so that said layer is in the form of foam flakes agglomerated by said fibres, said flakes occupying between 80% and 90% by weight of said layer, so that said fibres occupy between 20% and 10% by weight of said layer.

A molding device includes: a lower mold that supports a workpiece containing a thermoplastic resin and that is heated to a first predetermined temperature; an upper mold that is opposed to the lower mold, that presses the workpiece, and that is heated to a second predetermined temperature; a transferer that moves the lower mold and the upper mold relative to each other in a transfer direction of the workpiece; and control circuitry. The lower mold includes temperature-controlled regions adjacent to one another in the transfer direction, the temperature-controlled regions including a first lower mold temperature-controlled region and a second lower mold temperature-controlled region having a temperature lower than a temperature of the first lower mold temperature-controlled region. The control circuitry changes proportions of the first and second lower mold temperature-controlled regions in the lower mold as a function of a relative position between the upper and lower molds.