The presently disclosed subject matter is directed to a golf ball providing improve play characteristics. The disclosed golf ball includes an outer cover comprising a plurality of divots. The disclosed golf ball further includes a central core comprising one or more lightweight materials, such as aerogel. The combination of the lightweight core and the unique divots enable the golf ball to go farther and straighter when hit by the golfer, thereby providing increased performance.

A thermoplastic resin is molded to define a container bearing a surface 2D code signal, such as a digital watermark pattern. In some arrangements, the mold dimensions are tailored, and process parameters are selected, so that an indentation in the mold gives rise to a corresponding indentation—rather than a corresponding protrusion—in the shaped plastic. In other arrangements, a metal mold is provided with a patterned resin on its surface to define the 2D code signal. The resin may take the form of a rigid or non-rigid insert that can be removed or re-worked to change the code signal without changing the metal mold. A variety of other improvements and arrangements are also detailed.

The present invention relates to equipment covers. More particularly, the present invention relates to a method of making an equipment cover, the method comprising: moulding a cover from a substantially transparent or translucent polymer, optionally a thermoplastic polymer, to form a cover having a textured outer surface and a generally smoother inner surface; and applying a coating having reflective components to the inner surface.

A resin product including an antireflection surface includes a plurality of first concave portions, a plurality of second concave portions, and a component surface. The first concave portions have opening widths equal to or larger than 1 μm and equal to or smaller than 300 μm. The second concave portions are formed on each of the plurality of first concave portions and have opening widths equal to or larger than 10 nm and equal to or smaller than 1 μm. The component surface is configured to surround each of the plurality of first concave portions.

A system for molding an object includes an articulated mold having an axis and a plurality of mold portions configured to collectively define a molding cavity for shaping the object when arranged in respective molding positions. The system includes a plurality of actuators, each operatively coupled to a respective mold portion and configured to move the respective mold portion along the axis from the respective molding position toward a respective ejecting position for releasing the object. The system includes a controller in communication with each of the plurality of actuators and configured to independently activate each of the plurality of actuators such that one of the plurality of mold portions moves along the axis from the respective molding position toward the respective ejecting position while at least one other of the plurality of mold portions remains stationary relative to the object in order to at least partially support the object.

A replaceable mold part according to the present invention comprises: a depressed portion remained near a cavity; and a detachable portion, the detachable portion having a marking portion or a gas-releasing function, and being caught by a catch mechanism within the depressed portion. When a magnet is brought into proximity of the detachable portion through the cavity and an external magnetic field is applied, a magnet support portion's position is shifted from the fixed location to the released location within the depressed portion so that the catch mechanism of the detachable portion by the depressed portion is switched from the fixed state to the released state, thereby the detachable portion can easily be removed from the depressed portion through the cavity.

A mold for casting a micro-scale dry adhesive structure includes an upper surface including a first cavity having a first depth, a negative pattern for an array of micro-scale structures defined in a surface of the first cavity, and at least one second cavity having a second depth defined in the cavity outside of the negative pattern for the array of micro-scale structures, the at least one second cavity defining a negative pattern for a standoff of the micro-scale dry adhesive structure.

The present invention discloses a method of manufacturing a housing and an electronic device. The method comprises the following steps: preparing a mold according to a predetermined shape of the housing, wherein the mold comprises at least one moving die and at least one fixed die, a first texture structure is formed on the inner surface of the mold, and the first texture structure comprises a plurality of projections arranged in a first arrangement, and a groove recesses inwardly is formed between any two adjacent projections, and the groove is formed by etching and removing a part of the moving die and/or the fixed die by the laser engraving method; closing the moving die and the fixed die, and heating the mold to a predetermined mold temperature; and injecting a raw material in a melting state into the mold cavity of the mold; retaining a pressure of the raw material in the mold cavity of the mold; cooling the mold; opening the mold to complete the housing. The housing made of the first material exhibits a second material effect in visual and/or tactile senses.

Golf ball methods and molds for quickly and efficiently eliminating air/gas from within a mold during golf ball manufacture and the improved golf balls resulting therefrom.

An imprint lithography stamp includes a stamp body having a patterned surface and formed from a fluorinated ethylene propylene copolymer. The imprint lithography stamp further includes a backing plate with a plurality of through-holes with portions of the stamp body extending into the through-holes to adhere the stamp body to the backing plate. The patterned surface of the stamp body has a plurality of protrusions extending from the stamp body, which are used to form high aspect ratio features at high processing temperatures. A mold design for forming the imprint lithography stamp and an injection molding process for forming the imprint lithography stamp are also provided.