An injection molding method is provided. A molding device is provided and includes a first mold, a second mold over the first mold and a mold cavity defined by the first mold and the second mold. A first mixture is injected into the mold cavity through a first feeding port. A first component is formed from the first mixture. A second mixture is injected into the mold cavity through a second feeding port. A second component is formed from the second mixture. The second component is at least partially contact with the first component, and the first component and the second component have different physical properties.

A method for producing a product comprising an insert part with an edge reinforced by a plastic body injection-moulded onto the edge includes: providing an injection moulding tool comprising a cavity, a cavity-forming wall formed by a movable tool part which is movable such that when the movable tool part is moved away, a volume of the cavity is released; inserting the insert into the injection moulding tool such that the edge region to be injection-moulded is arranged in the cavity of the injection moulding tool; injecting plastic melt into the cavity so that it flows against a lateral surface facing away from the movable tool part, and presses another lateral surface of the edge region facing the movable tool part against the movable tool part until the cavity is filled with the plastic melt; and moving the movable tool part away and filling the released volume of the cavity.

The present invention relates to a mould half for a mould for transfer moulding encapsulating electronic components mounted on a carrier, where the mould part to support the carrier has a contact surface that includes a primary carrier support surface and a the primary carrier support surface surrounding secondary surface, which surrounding secondary surface is supported by a drive for height adjustment of the secondary surface relative to the height of the primary carrier support surface. Such mould half may be used for transfer moulding of electronic components while relatively easy providing a levelled support for the carrier and compensating for any thickness variations in the carrier. The invention also provides a mould with at least two mould parts and a method for transfer moulding encapsulating electronic components mounted on a carrier using such a mould.

An injection molding method and a deformable molding unit are provided. The method includes the following steps. First, a mold positioning step is performed to define a mold cavity. The step includes: providing a deformable molding unit on a first axis, the deformable molding unit having a deformable cavity and including a bottom portion and a first elastic portion being elastically deformable with respect to the bottom portion; and applying a first compression force to the first elastic portion by a first drive module along a second axis, reducing the size of the deformable cavity to a reduced dimension. Next, plastic is injected into the mold cavity including the deformable cavity with the reduced dimension to form a workpiece. Then, the first compression force is released, allowing the deformable cavity to return to its original dimension. Afterward, the deformable molding unit is retracted along the first axis.