A method of manufacturing a microfluidic device comprises molding a substrate using a master die having at least one outer stepped formation; and forming at least one microstructured formation having an outer rim, the depth of the outer rim being shallower than that of the microstructured formation.

A mold of a forming tool capable to be used for resin transfer molding processes or injecting molding processes, wherein an inner surface of the mold, which is adapted to limit on one side a forming tool cavity for a product to be fabricated, has an integral surface section which is adapted be moved relatively to adjacent surface areas in a demolding direction. Also a forming tool having such a mold and a method for demolding in which an integral inner surface section acts as membrane and is moved inside the cavity to push the product out of the mold.

An inkpad holder for arrangement in an insertion compartment of a self-inking stamp includes a one-piece body having a bottom and walls projecting therefrom which delimit a receiving space for receiving an inkpad. At least one wall of the inkpad holder has a retaining web protruding into the receiving space in order to retain the inkpad, the retaining web extending over the entire length of the wall.

An anti-fogging laminate including: a substrate; and an anti-fogging layer on the substrate where a surface of the anti-fogging layer is flat, wherein the anti-fogging layer includes a hydrophilic molecular structure; and wherein the anti-fogging layer has an elastic recovery of 90% or more, a coefficient of dynamic friction of 0.40 or less, and an average thickness of 4 m or more.

Provided is a cooling module to which a microporous cooling structure is applied, and a method of locally and conformally cooling a mold using the same. The cooling module to which a microporous cooling structure is applied which is installed at each high temperature region inside a mold core and allows supplied cooling fluid to flow thereinto to perform local and conformal cooling on a mold may include a body part inserted into the mold core, a microporous cooling structure which is inserted into an upper portion of the body part and in which micro unit cells are periodically and repeatedly formed to form a plurality of connected hollow portions, and a cooling channel including a conduit configured to pass the cooling fluid through the microporous cooling structure.

A housing for an electronic element comprises a wall separating an exterior space and an inner space, an opening between the exterior and inner spaces, and an elastically deformable sealing valve configured to be removably inserted in the opening. The sealing valve comprises an insert part for insertion into the opening and a support part for arrangement against the outer surface of the wall. The sealing valve forms a path in a longitudinal direction from an inlet opening in the support part to an outlet opening in the insert part. The support part comprises a first surface part for arrangement against the outer surface of the wall, and the insert part comprises a second surface part for arrangement against the inner surface of the wall. The first and second surfaces parts form a groove extending circumferentially along an outer surface of the sealing valve transverse to the longitudinal direction.

The device for demolding negatives in thermoplastic injection molds includes an ejector (3), which comprises an ejector profile (5) for the fastening thereof to an ejector plate (2), and a figure insert (6) with a profile that is complementary to the piece (4) to be molded, wherein said ejector (3) further comprises a flexible element (7) arranged between the ejector profile (5) and the figure insert, which pushes said figure insert (6) in order to demold the negative by means of angular displacement and stretches said figure insert (6) so as to return the ejector (3) to the injection position thereof.

It makes it so molding sliders are no longer necessary, hence, these spaces, the costly sliders, and the painstaking machining processes for the installation thereof in the molds are no longer required.

Plural ejector pins are made to project before a molten resin containing reinforcing fibers is injected into an inside of a cavity through pin point gates in a web forming portion in the inside of the cavity and at positions outside the pin point gates in a radial direction. The ejector pins are retracted from the inside of the cavity after a flow of the molten resin containing reinforcing fibers injected into the inside of the cavity through the pin point gates impinges on the ejector pins and is divided and before a tooth portion forming portion in the inside of the cavity is filled with the molten resin containing reinforcing fibers. Accordingly, weld lines which extend along the radial direction are formed at positions outside the ejector pins in the radial direction, and the molten resin is filled in portions formed after the ejector pins are retracted.

An electrical mold clamping apparatus of a plastic injection molding machines includes a motor unit mounted onto a link base for driving a gear at an end of a ball screw in the link base to rotate and a ball screw socket disposed at a fixed base, and the other end of the ball screw of the link base is screwed into the ball screw socket. When the motor unit drives the ball screw to rotate, the link base is displaced with the rotation of the ball screw to achieve the effect of reducing the load of the motor unit as well as the loss of energy.

An electronic device includes a molded component including a first surface. The molded component includes a first portion formed of a first resin material and a second portion formed of a second resin material, the second portion including an exposure region in the first surface as at least a part thereof being embedded in the first portion. The molded component includes a first line in the first surface. At least a part of the first line passes through the inside of the exposure region.