A molding material supply device and a molding material supply method capable of supplying a degassed molding material to a molding apparatus at a desired timing are desired. According to the molding material supply device and method of the disclosure, a first discharge member is driven to discharge a molding material accommodated in a first accommodation member to a second discharge member through a through hole of a die, and a second discharge member configured by the first accommodation member and the die advances to discharge the molding material having been degassed in the second accommodation member to the molding apparatus from a molding material supply port.

A molding material supply device and a molding material supply method capable of supplying a degassed molding material to a molding apparatus at a desired timing are desired. According to the molding material supply device and method of the disclosure, a first discharge member is driven to discharge a molding material accommodated in a first accommodation member to a second discharge member through a through hole of a die, and a second discharge member configured by the first accommodation member and the die advances to discharge the molding material having been degassed in the second accommodation member to the molding apparatus from a molding material supply port.

Disclosed are a three dimensional injection molding apparatus and an injection molding method which are capable of manufacturing an injection molded product having patterns, colors, and textures which are high quality by injection molding after completely removing a gas included in a melted resin, and transferring a surface layer for expressing the patterns, colors, and textures to the injection molded product.

A nozzle assembly for an injection molding system has a nozzle adapter with one or more vent holes therein. A porous metal insert is provided in fluid communication with at least one of the vent holes. The porous metal insert is also in fluid communication with a flow channel through the nozzle assembly. As molten polymeric material advances through the flow channel from a barrel to a mold assembly, gases entrained in the molten polymeric material are vented through the porous metal insert and escape through the one or more vent holes. Pressurized air may be introduced through the vent holes, such as by one or more blow-back modules, to unclog pores of the one or more porous metal inserts between shots of the injection molding system.

A nozzle assembly for an injection molding system has a nozzle adapter with one or more vent holes therein. A porous metal insert is provided in fluid communication with at least one of the vent holes. The porous metal insert is also in fluid communication with a flow channel through the nozzle assembly. As molten polymeric material advances through the flow channel from a barrel to a mold assembly, gases entrained in the molten polymeric material are vented through the porous metal insert and escape through the one or more vent holes. Pressurized air may be introduced through the vent holes, such as by one or more blow-back modules, to unclog pores of the one or more porous metal inserts between shots of the injection molding system.

A method for producing a foam-molded product by using a plasticizing cylinder, includes: plasticizing and melting the thermoplastic resin to provide the molten resin in a plasticization zone of the plasticizing cylinder; introducing a pressurized fluid containing the physical foaming agent at a fixed pressure into a starvation zone of the plasticizing cylinder to retain the starvation zone at the fixed pressure; allowing the molten resin to be in the starved state in the starvation zone; bringing the molten resin in contact with the pressurized fluid containing the physical foaming agent at the fixed pressure, in the starvation zone in a state in which the starvation zone is retained at the fixed pressure; and molding the molten resin having been brought in contact with the pressurized fluid containing the physical foaming agent into the foam-molded product.

An apparatus for molding a part includes a plunger cavity, a plunger, and a mold cavity, wherein the plunger is oriented out-of-plane with respect to a major surface of the mold cavity, and first and second vents couples to respective first and second portions of the mold cavity. In a method, resin and fiber are forced into the mold cavity from a plunger cavity, and at least some of the fibers and resin are preferentially flowed to certain region in the mold cavity via the use of vents.

An apparatus for molding a part includes a plunger cavity, a plunger, and a mold cavity, wherein the plunger is oriented out-of-plane with respect to a major surface of the mold cavity, and first and second vents couples to respective first and second portions of the mold cavity. In a method, resin and fiber are forced into the mold cavity from a plunger cavity, and at least some of the fibers and resin are preferentially flowed to certain region in the mold cavity via the use of vents.

A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.