The disclosed embodiments include a system and method for manufacturing a lens. In one embodiment, the system includes a lens mold. According to the embodiment, the lens mold contains a part cavity and a material flow path fluidly coupled to the part cavity and a lens material inlet. The system also includes a heat transfer insert. According to the embodiment, the heat transfer insert includes an insert surface positioned adjacent to a part surface of the cavity, a sealed fluid inlet, a sealed fluid outlet, and a conformal fluid conduit that extends from the sealed fluid inlet to the sealed fluid outlet.

An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator, a mold and a cooling device, wherein the cooling device comprises: a heat transmitter comprising a distal arm or member and a proximal base or member, the distal arm or member or member being mounted by a spring loadable interconnection or engagement to or with the proximal base or member, the clamp plate, the mold, the manifold, the actuator and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate.

An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator, a mold and a cooling device, wherein the cooling device comprises: a heat transmitter comprising a distal arm or member and a proximal base or member, the distal arm or member or member being mounted by a spring loadable interconnection or engagement to or with the proximal base or member, the clamp plate, the mold, the manifold, the actuator and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate.

An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator, a mold and a cooling device,

wherein the cooling device comprises:

a heat transmitter comprising a distal arm or member and a proximal base or member, the distal arm or member or member being mounted by a spring loadable interconnection or engagement to or with the proximal base or member,

the clamp plate, the mold, the manifold, the actuator and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate.

An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator, a mold and a cooling device, wherein the cooling device comprises:

a heat transmitter comprising a distal arm or member and a proximal base or member, the distal arm or member being mounted by a spring loadable interconnection or engagement to or with the proximal base or member,

the clamp plate, the mold, the manifold, the actuator and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate.

An apparatus includes a cooling pin to slidably extend from a frame and to be inserted into an injection molded article. The cooling pin is hollow to allow for flow of cooling fluid through the cooling pin. The cooling pin has a hole to be in fluid communication with a source of vacuum to draw cooling fluid within the injection molded article into the cooling pin. The cooling pin has a first position with respect to the frame, the first position to allow flow of cooling fluid through the hole. The cooling pin has a second position with respect to the frame, the second position to shut off flow of cooling fluid into the cooling pin.

A mold insert includes a plurality of microstructures along a surface of the mold insert and a metal alloy, wherein the metal alloy has a thermal conductivity between 1 and 50 W/m-K. and wherein the metal alloy has a modulus of between 100 GPa and 1000 GPa.

The invention relates to a mold for small-sized parts, comprising a casing configured to be assembled on a press platen (101, 102) the casing comprising a housing receiving an insert; the insert comprising a housing for a die comprising a molding surface (121, 122); a device for heating the die, the device comprising a rod (131, 132) made of a material susceptible to induction heating mounted in the insert (350) and having one end in contact with the die, a coil (141, 142) surrounding the rod and connected to a high-frequency current generator (151, 152) such that when the coil is electrically powered, it generates an induced current in the rod (131, 132), heating the rod by induction, the rod transmitting heat to the die, wherein an outer diameter of the rod is greater than or equal to an outer diameter of a perimeter delimiting the molding surface (121, 122).

An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator, a mold and a cooling device,

wherein the cooling device comprises:

a heat transmitter comprising a distal arm or member and a proximal base or member, the distal arm or member being mounted by a spring loadable interconnection or engagement to or with the proximal base or member,

the clamp plate, the mold, the manifold, the actuator and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate.

An injection molding apparatus comprising a clamp plate, a heated manifold, an actuator, a mold and a cooling device, wherein the cooling device comprises: a heat transmitter comprising a distal arm or member and a proximal base or member, the distal arm or member being mounted by a spring loadable interconnection or engagement to or with the proximal base or member, the clamp plate, the mold, the manifold, the actuator and the heat transmitter being assemblable together in an arrangement wherein the spring loadable interconnection is loaded urging the distal end surface of the distal arm or member into compressed engagement with the clamp plate.