The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

Imprinted substrates are often used to produce miniaturized devices for use in electrical, optic and biochemical applications. Imprinting techniques, such as nanoimprinting lithography, may leave residues in the surface of substrates that affect bonding and decrease the quality of the produced devices. An imprinted substrate with residue-free region, or regions with a reduced amount of residue for improved bonding quality is introduced. Methods to produce imprinted substrates without residues from the imprinting process are also introduced. Methods include physical exclusion methods, selective etching methods and energy application methods. These methods may produce residue-free regions in the surface of the substrate that can be used to produce higher strength bonding.

A residential or commercial building, structure, or building component can include an exterior member, interior member, and plurality of cross-members spatially disposed therebetween. Each of the exterior member, interior member, cross-members can be formed from a multi-layered stack of polymeric material made by a layered three-dimensional printing process, and all can be monolithically integrated. An exterior surface region of the exterior member can have an integrally formed surface finish. Overlying finishing or connective layers can be added. The exterior and interior members can be configured in a parallel arrangement to form a rectangular or curve shaped building block. A fill material can be disposed into openings between the exterior and interior members, and an interior surface region at the interior member can include a cavity configured for an electrical box, plumbing, or a sensing device.

Imprinted substrates are often used to produce miniaturized devices for use in electrical, optic and biochemical applications. Imprinting techniques, such as nanoimprinting lithography, may leave residues in the surface of substrates that affect bonding and decrease the quality of the produced devices. An imprinted substrate with residue-free region, or regions with a reduced amount of residue for improved bonding quality is introduced. Methods to produce imprinted substrates without residues from the imprinting process are also introduced. Methods include physical exclusion methods, selective etching methods and energy application methods. These methods may produce residue-free regions in the surface of the substrate that can be used to produce higher strength bonding.

The invention relates to a device comprising a first fixing element, a further fixing element and a folded planar composite; wherein the first fixing element comprises a first fixing surface and the further fixing element comprises a further fixing surface; wherein the folded planar composite is at least partially fixed between the first fixing surface and the further fixing surface; wherein the folded planar composite comprises a first composite region; wherein the first composite region comprises a first layer sequence comprising a first composite layer comprising a first carrier layer, a second composite layer comprising a second carrier layer, a third composite layer comprising a third carrier layer and a fourth composite layer comprising a fourth carrier layer; wherein in the first composite region the second composite layer is joined to the third composite layer and the third composite layer is joined to the fourth composite layer; wherein in the first composite region the third carrier layer is characterised by a smaller layer thickness than in each case one selected from the group consisting of the first carrier layer, the second carrier layer and the fourth carrier layer or a combination of at least two of these; wherein the first fixing surface or the further fixing surface or both comprises a recess comprising a first recess region; wherein the first composite region is located at least partially between the first recess region and the first fixing surface or the further fixing surface.

A machine for gluing a ring-shaped workpiece prior to machining operations. The machine includes a support assembly adapted to receive a removable support element having a top surface for receiving a workpiece; a glue dispenser system adapted to apply a predefined amount of glue on a face of at least one of the workpiece and the support element; a gripper assembly for placing a workpiece on the support element; an illuminating system adapted to illuminate the applied glue with ultraviolet light, this illuminating system including: at least one inner lighting element for radially illuminating an inner radial face of the ring-shaped workpiece with ultraviolet light, and at least one outer lighting element for radially illuminating an outer radial face of the ring-shaped workpiece with ultraviolet light.

An edge trim for pieces of furniture, including a meltable layer, is described. The molecular structure of the meltable layer contains both polar and non-polar parts. By way of a non-limiting example, an edge trim for pieces of furniture having an exposed edge of wooden or wood substitute material is described, comprising a molten layer and a structural layer, wherein the structural layer and the molten layer are connected in an adhesive bond, wherein the molten layer is made of a material that is chemically modified such that polar and non-polar components are found in a single molecular structure, wherein the molten layer contains energy absorbing additives, wherein the energy absorbing additives of the molten layer are selected from the group consisting of metal oxides, metal phosphates, metal salts of organic anions and combinations thereof.

The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

Methods for applying high shrink wrap labels to a shaped article are disclosed. The leading edge of the label is bonded to the article. A seaming agent is applied, and the label is wrapped around the article. The seaming agent is then exposed to radiation to cure the seaming agent, and the label is then exposed to heat to cause heat-shrinking. The label is made of a film with at least one external layer that has a Hildebrand solubility parameter. The seaming agent includes a component having a Hildebrand solubility parameter that is within 2.2 MPa.sup.1/2 or within 4.4 calories.sup.1/2.Math.cm.sup.3/2 of the Hildebrand solubility parameter of the external layer of the film. The seaming agent also has a viscosity of at least 1 centipoise and less than 1000 centipoise when measured at any temperature between ambient temperature and 60 C. Articles including such affixed high shrink wrap labels are also disclosed.

Described herein are techniques for reducing resin squeeze-out including a method comprising receiving a first component and a second component, where the first component is configured to be joined to the second component at an overlap area using an adhesive layer to form a structure having a ledge. The method further comprises applying the adhesive layer to the overlap area on the first component. The method further comprises selectively curing a portion of the adhesive layer adjacent to the ledge. The method further comprises forming the structure by combining the first component, the second component, and the adhesive layer and curing a remainder of the adhesive layer.