The invention relates to an edge trim for pieces of furniture, comprising a meltable layer. In order to improve a generic edge trim such that the same is more versatile and can especially be mounted on a wider selection of surfaces, the molecular structure of the meltable layer contains both polar and non-polar parts.

An array of resilient floor tiles is assembled into a continuous sheet after being laid down. An array of included, sacrificial resistive wires is buried along the edges of the tiles and is controllably heated in order to cause welding of the edges of tiles across the paths of the wires to neighboring tiles. Subsequently the wires may be used to give the array integral tensile strength. The welded array is provided with greater strength for resisting use, expansive and contractile forces caused by environmental heat and cold and also long-term tile contraction owing to loss of plasticizer as may be seen with PVC-based tiles.

A method and apparatus to mitigate the severity of the bond-line read-out defect, and more specifically microwave heating to locally cure adhesive bond-line in a single or two stage process comprising heating thermoset adhesive with microwave radiation until the adhesive is fully cured or partially cured. If the adhesive is partially cured, it can be fully cured by being subjected to an additional thermal cycle.

Aspects of the present invention relate to systems and methods for customizing microwave energy distribution within a chamber to accommodate various load characteristics. Aspects of the present invention customized configurations of ports, deflectors, waveguides, conducting rods, and slots to shape and distribute energy.

A method of doping a substrate with dielectric dopant particles. The substrate, comprising an organic polymer, is exposed to a first layer comprising a first plurality of dielectric dopant particles. The organic polymer has a thermal conductivity that is less than 5 Wm.sup.1K.sup.1 and a lossiness that is less than a lossiness of the first plurality of dielectric dopant particles. The substrate and first layer are irradiated by an energy source operating at an operating frequency. During the irradiation, the first plurality of dielectric dopant particles of the first layer diffuses into the organic polymer of the substrate. Irradiation continues for a first desired time to achieve a first desired depth of penetration of the first plurality of dielectric dopant particles into the organic polymer.

A welding device for the sealing welding of thermopolastic hoses (184), includes a clamping device (12) with at least two clamping jaws (122, 124), of which at least one is movable and between which a hose (184) which is to be welded can be clamped, wherein the clamping device (12) has a heating devices (38; 40; 64) which is coupled to a control unit (30) and is configured to heat the hose clamped between the clamping jaws (122, 124). The invention is distinguished in that the at least one movable clamping jaw (122) is actuable with a controllable, bidirectional actuator (32, 34; 42-52; 54, 56, 58) which is coupled to the control unit (30) in such a manner that the clamping pressure acting on the hose (184) can be adjusted independently of the heating device.

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.