B29C65/30

Sidewall bonder and method for bonding sidewalls to thermoplastic belts
11040497 · 2021-06-22 · ·

A bonder and a method for bonding corrugated sidewalls to a thermoplastic belt at a splice joint. Two heating jaw assemblies with complementary and confronting corrugated vertical faces clamp a thermoplastic belt to a base of the bonder with a corrugated sidewall section separated from the belt across a splice joint received in a corrugated slot formed between the confronting vertical faces. Corrugated bonding strips at the bottoms of the corrugated vertical faces apply heat to melt the bottom of the sidewall section on opposite sides to bond the corrugated sidewall section to the base.

Dual purpose seal head assembly, tray sealing system, and method therefor

A seal head assembly includes a plurality of heat seal plates defining a corresponding plurality of heating areas, each heat seal plate including a heating element to independently control the temperature of the corresponding heating area.

TRAY SEALER AND OPERATING METHOD
20210122505 · 2021-04-29 ·

An apparatus and a process can be used for packaging a product wherein a plastic film is tightly applied to a support. The plastic film is positioned above the support by means of a transport system; moreover, a stop structure or plate is active on the film portion present in the packaging station to efficiently hold the same.

APPARATUS AND PROCESS FOR PACKAGING PRODUCTS
20210122513 · 2021-04-29 ·

The present invention refers to an apparatus and process for packaging a product wherein a plastic film is tightly applied to a support. The plastic film is positioned above the support by means of a transport system; moreover, a stop structure or plate is active on the film portion present in the packaging station for enabling to efficiently hold the same.

HEAD FOR HORIZONTAL FLOW WRAPPER PACKAGING MACHINE
20210101704 · 2021-04-08 ·

A head for a horizontal flow wrapper packaging machine for forming a bandolier of product packages. The head includes a rotatable first shaft having a plurality of knife elements each including a blade and first and second upper crimping elements. The head also includes a rotatable second shaft having a plurality of anvil elements. A rotation speed of the second shaft is independent of the rotation speed of the first shaft. Each anvil element includes perforation and cutting surfaces and first and second lower crimping elements. A rotation speed of either the first shaft or second shaft is changed to move either a knife element or an anvil element, respectively, between a perforation position and a cutting position. The first upper and first lower crimping elements and the second upper and second lower crimping elements also mate to crimp the packaging material in either the perforating or cutting positions.

HEAD FOR HORIZONTAL FLOW WRAPPER PACKAGING MACHINE
20210101704 · 2021-04-08 ·

A head for a horizontal flow wrapper packaging machine for forming a bandolier of product packages. The head includes a rotatable first shaft having a plurality of knife elements each including a blade and first and second upper crimping elements. The head also includes a rotatable second shaft having a plurality of anvil elements. A rotation speed of the second shaft is independent of the rotation speed of the first shaft. Each anvil element includes perforation and cutting surfaces and first and second lower crimping elements. A rotation speed of either the first shaft or second shaft is changed to move either a knife element or an anvil element, respectively, between a perforation position and a cutting position. The first upper and first lower crimping elements and the second upper and second lower crimping elements also mate to crimp the packaging material in either the perforating or cutting positions.

HEAT-CAULKING DEVICE

This heat-caulking device is inserted into one or more holes penetrating a main plate having a substantially conical hollow portion, whereby one or more bosses of a blade protruding from an inner peripheral surface of the main plate toward the hollow portion are melted so as to join the main plate and the blade. A heat chip of the heat-caulking device has a substantially conical hollow main body portion, an outer peripheral surface of which conforms to the inner peripheral surface of the main plate. On the outer peripheral surface of the main body portion, a convex portion protruding toward the vicinity of the holes of the inner peripheral surface of the main plate is provided.

HEAT-CAULKING DEVICE

This heat-caulking device is inserted into one or more holes penetrating a main plate having a substantially conical hollow portion, whereby one or more bosses of a blade protruding from an inner peripheral surface of the main plate toward the hollow portion are melted so as to join the main plate and the blade. A heat chip of the heat-caulking device has a substantially conical hollow main body portion, an outer peripheral surface of which conforms to the inner peripheral surface of the main plate. On the outer peripheral surface of the main body portion, a convex portion protruding toward the vicinity of the holes of the inner peripheral surface of the main plate is provided.

Method of manufacturing a semiconductor package

A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.

Method of manufacturing a semiconductor package

A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.