Patent classifications
B29C65/30
Method and system for forming packages
A method of sealing reinforced packages. The method can comprise moving an open-ended package in a downstream direction on a package conveyor by engaging the open-ended package with a chain flight of the package conveyor moving in the downstream direction. The method further can comprise forming a bag with a closed end by engaging at least a seal portion of a tail section of an open-ended tube portion of the open-ended package between the chain flight of the package conveyor and a hot plate positioned adjacent the package conveyor. The chain flight can move with the tail section in the downstream direction relative to the hot plate, which can transfer thermal energy to the tail section to at least partially form a seal along the seal portion in the tail section to at least partially form the closed end of the bag.
Apparatus and method for establishing or for separating a connection having material continuity or having material continuity and shape matching of at least one metal or ceramic component and of a component formed from or by a thermoplastic polymer
The invention relates to an apparatus and to a method for establishing a connection having material continuity or having material continuity and shaping matching or for separating such a connection of at least one metal or ceramic component and of a component formed from or by a thermoplastic polymer in which the components to be joined together can be pressed together by a pressing device having a counterholder and a plunger. A heating device is present at the plunger and/or at the counterholder or acts there. A heating of the at least one metal or ceramic component up to above the softening temperature of the component formed from or by polymer can be achieved with the heating device, with the heating device being having at least one electrical resistance heating element that is covered by an electrically insulating, preferably ceramic, protective film, and/or having at least one laser beam that is directed to the metal component(s) within the joining region, and/or having at least one inductor present at the plunger and/or at the counterholder for the inductive heating of the meal component(s).
Apparatus and method for establishing or for separating a connection having material continuity or having material continuity and shape matching of at least one metal or ceramic component and of a component formed from or by a thermoplastic polymer
The invention relates to an apparatus and to a method for establishing a connection having material continuity or having material continuity and shaping matching or for separating such a connection of at least one metal or ceramic component and of a component formed from or by a thermoplastic polymer in which the components to be joined together can be pressed together by a pressing device having a counterholder and a plunger. A heating device is present at the plunger and/or at the counterholder or acts there. A heating of the at least one metal or ceramic component up to above the softening temperature of the component formed from or by polymer can be achieved with the heating device, with the heating device being having at least one electrical resistance heating element that is covered by an electrically insulating, preferably ceramic, protective film, and/or having at least one laser beam that is directed to the metal component(s) within the joining region, and/or having at least one inductor present at the plunger and/or at the counterholder for the inductive heating of the meal component(s).
Closed loop heat staking device and method
A novel spring-loaded device utilizes a linear or rotary measuring sensor to measure distance and control heat using a PID loop or other type of control loop feedback program. The power of the heating element is controlled by a program, which takes distance from the target into consideration when determining output power. For example, if the target distance is 10 mm away the algorithm will apply 100% power until reaching 9 mm, at which point it will lower power to 90%. When the distance is 5 mm from the target, the power level will be 50%, and so on and so forth. The closed loop nature of the system will reduce power automatically using pulse width modulation (PWM) of the input power. This will allow modulation of the power to the heating element on the fly.
Closed loop heat staking device and method
A novel spring-loaded device utilizes a linear or rotary measuring sensor to measure distance and control heat using a PID loop or other type of control loop feedback program. The power of the heating element is controlled by a program, which takes distance from the target into consideration when determining output power. For example, if the target distance is 10 mm away the algorithm will apply 100% power until reaching 9 mm, at which point it will lower power to 90%. When the distance is 5 mm from the target, the power level will be 50%, and so on and so forth. The closed loop nature of the system will reduce power automatically using pulse width modulation (PWM) of the input power. This will allow modulation of the power to the heating element on the fly.
Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.
CUT AND SEAL METHOD AND APPARATUS
A fin sealer and method to seal a radially outwardly directed fin of a tubular web structure by directing the fin through a nip between a first and a second fin sealing rollers while communicating heat to the fin through at least one of the fin sealing rollers is provided. The fin sealer is configured to maintain a nominal face-to-face relation between an outer annulus of the first fin sealing roller and an outer annulus of the second fin sealing roller with a flexible connection between a hub element of the second fin sealing roller with the outer annulus of the second fin sealing roller.
WELDING DEVICE AND WELDING METHOD
Provided are a welding device and a welding method that can realize efficient welding in terms of time and in terms of energy. The embodiment includes: a first graphite heater 110 and a second graphite heater 120 that come into contact with a first member 210 and a second member 220; and a first die 130 and a second die 140 that interpose the first and second graphite heaters 110, 120 between each of the first and second members 210, 220 and each die. The first and second graphite heaters 110, 120 have graphite sheets 114, 124 that generate heat by electric power, insulating materials 113, 123, outer covers 111, 121, and inner covers 112, 122 and are configured such that structures of the graphite sheets 114, 124 and the insulating materials 113, 123 interposing the graphite sheets are interposed between outer covers 111, 121 and inner covers 112, 122.
WELDING DEVICE AND WELDING METHOD
Provided are a welding device and a welding method that can realize efficient welding in terms of time and in terms of energy. The embodiment includes: a first graphite heater 110 and a second graphite heater 120 that come into contact with a first member 210 and a second member 220; and a first die 130 and a second die 140 that interpose the first and second graphite heaters 110, 120 between each of the first and second members 210, 220 and each die. The first and second graphite heaters 110, 120 have graphite sheets 114, 124 that generate heat by electric power, insulating materials 113, 123, outer covers 111, 121, and inner covers 112, 122 and are configured such that structures of the graphite sheets 114, 124 and the insulating materials 113, 123 interposing the graphite sheets are interposed between outer covers 111, 121 and inner covers 112, 122.