B29C65/489

Packaging method and display device
10205134 · 2019-02-12 · ·

A packaging method and a display device are disclosed. The packaging method includes: packaging a display element on a substrate having the display element disposed thereon to form a package covering the display element, wherein a first substance is disposed on at least a part of the substrate inside the package, the first substance including thermite; and initiating the first substance to obtain a second substance including a product of the thermite reaction.

METHOD FOR JOINING A DEVICE TO AN OBJECT WITH THE AID OF ULTRASONIC VIBRATION ENERGY AND DEVICE AND INSTALLATION SUITABLE FOR THE METHOD

A method for joining a device to an object with the aid of a combination of ultrasonic vibration energy and induction heating, wherein the device includes a portion of a thermoplastic polymer and a susceptor additive wherein this portion is at least partly liquefied or plasticized through the ultrasonic vibration energy in combination with the induction heating and wherein the joining includes establishing a connection between the device and the object which connection is at least one of a positive fit connection, a weld, a press fit connection, and an adhesive connection. The induction heating is applied for rendering the device portion suitable for absorption of ultrasonic vibration energy than other device portions by raising its temperature above the glass transition temperature of the polymer. The ultrasonic vibration energy is used for liquefying or at least plasticizing the thermoplastic polymer of the named device portion.

Conductive film adhesive

An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.

Reversible adhesive compositions and related methods

The disclosure relates to reversible bonded structural joints using active adhesive compositions that can allow for dis-assembly, repair, and re-assembly. The disclosure is particularly directed to the adhesive composition material, irrespective of the type of the substrate(s) being joined. The adhesive composition can include any thermoplastic adhesive material that can be remotely activated for targeted heating of just the adhesive composition (e.g., and not the surrounding substrates being joined) via the inclusion of electromagnetically excitable particles in the adhesive composition. The substrates can be any metal material, any composite material, any hybrid material, or otherwise. The disclosed adhesive compositions allow for recyclability of parts at the end of their lifetime and repair/replacement of parts during their lifetime.

Method and device for joining components

A method for joining a first and a second component, at least one of which comprises a fiber-reinforced plastics material. The components are arranged in relation to one another in such a way that a gap region remains between the first and the second component. The gap region is filled, at least in portions, with an uncured plastics material filler in which nanoparticles are dispersed. Energy is introduced locally into the nanoparticles in order to cure the plastics material filler. In another aspect, the invention provides a device for joining two components.

HEAT BONDING OF LOW ENERGY SURFACE SUBSTRATES
20180186141 · 2018-07-05 ·

A method comprising providing a polymeric substrate having a melting point of from about 130 C. to about 190 C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100 C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.

Method for making a low ohmic pressure-contact electrical connection between split ring electrode and lead wire
10004417 · 2018-06-26 · ·

A method for attaching a split ring electrode to a catheter tip section includes providing a tubing with a lumen and an opening in the tubing side wall, passing an electrode lead wire through the opening, and wrapping the lead wire around the tubing. A split ring electrode is mounted on the tubing over the wrapped lead wire and opening, with electrically-conductive thermoplastic elastomeric adhesive applied between the ring electrode and the outer surface of the tubing, and reheated to reflow.

Conductive Fastening System for Composite Structures
20180170576 · 2018-06-21 · ·

A conductive fastener system for connecting a composite structure to a support structure includes a composite structure hole that extends through the composite structure and shares a common axis with a support structure hole that extends at least partially through the support structure. A fastener comprising a shank having an outer surface passes through the composite structure hole and at least partially through the support structure hole and provides an annular space between the outer surface of the shank and the inner surface of the composite structure hole. The annular space is filled with a conductive paste that comprises conductive particles suspended in a bonding agent.

JOINING METHOD AND DEVICE FOR PERFORMING THE JOINING METHOD

A method for joining a fastener to a workpiece. The method comprising the following steps. Providing a fastening element including: a shaft-shaped anchor section which extends between a first end and a second end along an anchor axis; a flange formed on and extending radially to the first end of the anchor section, and the flange at least partially forms an application section, and; a joining material pre-applied to the application section and lying in an at least partially solid state, and wherein the joining material includes a first adhesive material and a second adhesive material. Providing a workpiece including a carrier surface. Arranging the fastening element on the carrier surface. Mixing the first and second adhesive materials by rotating the fastening element. And, joining the fastening element to the workpiece via the cross-linking reaction of the first and second adhesive materials.

ADHESIVE AND STRUCTURE, AND ADHESION METHOD

Provided is an adhesive that can provide quick bonding between thermoplastic resins and excellent bond strength, a structure having adhesion provided by the adhesive, and an adhesion method using the adhesive. The adhesive bonds a first member (11) containing a thermoplastic resin or a carbon fiber reinforced thermoplastic resin and a second member (12) containing the thermoplastic resin or the carbon fiber reinforced thermoplastic resin. The adhesive includes a thermoplastic resin as a main component containing a metal nano material that absorbs electromagnetic waves and generates heat.