In various embodiments, a hot melt device comprising a heating device that is automatically or manually triggered is configured so as to have its melt surface applied bringing a thermoplastic material in its solid form into contact with a surface via mechanical extrusion; using a heater to heat the thermoplastic material to a temperature above a melting temperature of the thermoplastic material while maintaining the contact of the thermoplastic material with the surface; allowing the heated thermoplastic material to cool to a temperature that is below the thermoplastic material's melting temperature; and allowing the heated thermoplastic material to bond the hot melt apparatus to the contacted surface without a solvent or use of a curing chemical reaction when the heated thermoplastic material is cooled to below the thermoplastic material's melting temperature while remaining connected to the structural body.

A slot die assembly for applying at least one material onto a substrate includes an adapter having a passive heat transfer device, a shim package fluidically connected to the adapter, the shim package having a first material discharge slot and a second material discharge slot, and a die plate having a one or more fluid channels fluidically connected to the shim package. The assembly also includes one or more mounting studs extending from the adapter, the mounting studs configured to engage a parent machine.

A contact nozzle for coating an elastic strand with an adhesive. Air is discharged at the adhesive in contact with the strand, causing the adhesive to spread around the periphery of the strand. The air assists with release of the adhesive from the nozzle and also cleans the nozzle to discourage adhesive build-up on the nozzle.

A glue delivery system and method for providing precise application of glue on a substrate. A bead of glue is extruded from a first glue chamber to a leading edge of the substrate. A trailing edge of the substrate is blown off and over to the nozzle to receive a smear of glue from a second glue chamber. A gear pump is controlled by a servo drive that is connected to a servomotor utilizing a gear reducer. The pump regulates the extrusion of the glue onto the substrate that is programmed with empirical data of gear reducer ratio at which the glue flows within a constant speed, torque, current, speed and position of the glue. The empirical data is provided to a programmable logic circuit to achieve a precise pressure related to volume of a glue deposition and speed of the substrate onto which the glue is applied.

A method for attaching a split ring electrode to a catheter tip section includes providing a tubing with a lumen and an opening in the tubing side wall, passing an electrode lead wire through the opening, and wrapping the lead wire around the tubing. A split ring electrode is mounted on the tubing over the wrapped lead wire and opening, with electrically-conductive thermoplastic elastomeric adhesive applied between the ring electrode and the outer surface of the tubing, and reheated to reflow.

A repair system that includes a handheld device comprising a first extruder tip having an interior passageway extending between an inlet and a tip outlet, wherein the inlet is configured to receive a solid thermoplastic material and the tip outlet is configured to dispense a fluidic thermoplastic material; a nozzle surrounding the first extruder tip to form an annulus between an interior surface of the nozzle and an exterior surface of the first extruder tip; and a heater that is configured to heat the interior passageway of the first extruder tip such that the solid thermoplastic material becomes the fluidic thermoplastic material. In some embodiments, the repair system also includes a gas source in fluid communication with the annulus such that a skirt-shaped curtain of gas extends from the annulus and in a direction towards the tip outlet of the extruder tip.

A slot die assembly for applying at least one material onto a substrate includes an adapter having a passive heat transfer device, a shim package fluidically connected to the adapter, the shim package having a first material discharge slot and a second material discharge slot, and a die plate having a one or more fluid channels fluidically connected to the shim package. The assembly also includes one or more mounting studs extending from the adapter, the mounting studs configured to engage a parent machine.

A liner assembly and method for lining a damaged pipe junction between a main and lateral pipe is provided. The liner assembly includes a main liner member and a lateral liner tube. A collar disposed near the juncture between the main liner member and lateral liner tube is impregnated with a liquid hydrophobic or hydrophilic material capable of curing in a flexible or rigid state with the material expanding in the presence of water. The hydrophobic or hydrophilic material can also be applied without the use of the collar. When the liner assembly is pressed against the main and lateral pipes, a portion of the hydrophilic or hydrophobic material is forced into the damaged pipe junction.

An applicator for applying two materials to a substrate includes a central module configured to receive a first material, a tee block configured to receive a second material, a pair of outer modules spaced from and disposed on opposite sides of the central module, each outer module fluidically connected to and configured to receive the second material from the tee block, and a slot die assembly disposed in fluid communication with the central module and the pair of outer modules, the slot die assembly configured to receive the first and second materials from the central and outer modules, respectively, and discharge the first material over a first width and the second material over a second width greater than the first width.

A glue delivery system and method for providing precise application of glue on a substrate. A bead of glue is extruded from a first glue chamber to a leading edge of the substrate. A trailing edge of the substrate is blown off and over to the nozzle to receive a smear of glue from a second glue chamber. A gear pump is controlled by a servo drive that is connected to a servomotor utilizing a gear reducer. The pump regulates the extrusion of the glue onto the substrate that is programmed with empirical data of gear reducer ratio at which the glue flows within a constant speed, torque, current, speed and position of the glue. The empirical data is provided to a programmable logic circuit to achieve a precise pressure related to volume of a glue deposition and speed of the substrate onto which the glue is applied.