A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot including an insulating layer and a gel layer located on the insulating layer.

A particle removal device including a particle removal sticker. The particle removal sticker including a top side and a bottom side. The bottom side of the particle removal sticker includes an adhesive configured to removably adhere to a screen of an electronic device. The particle removal device also includes a sticker release liner. The sticker release liner includes a top side removably attached to the bottom side of the particle removal sticker. The sticker release liner is configured to be removed from the bottom side of the particle removal sticker to expose the adhesive and to adhere the particle removal sticker to the screen. The particle removal sticker is configured to remove particles as the particle removal sticker is removed from the screen. Other embodiments are provided.

A cradle device including a device slot configured to hold an electronic device. The device slot includes one or more frames. The one or more frames are configured to securely hold the electronic device in the device slot as an overlay applicator is applied to a screen of the electronic device. The cradle device also includes an alignment base. The alignment base is configured to engage with an alignment mechanism of the overlay applicator. The alignment base is configured to align the overlay applicator with the screen of the electronic device as the overlay applicator is applied to the screen. Other embodiments are provided.

An overlay applicator machine including a support base configured to hold an electronic device. The overlay applicator machine also includes a lid attached to the support base. The overlay applicator machine additionally includes a hinge mechanism attaching the lid to the support base. The hinge mechanism allows the lid to rotate with respect to the support base. The support base and the lid are configured to enclose the electronic device in a closed configuration. The overlay applicator machine further includes an alignment base. The alignment base is configured to engage with an alignment mechanism of an overlay applicator. The alignment base is configured to align the overlay applicator with a screen of the electronic device as the overlay applicator is applied to the screen. The overlay applicator machine additionally includes an end slot. The end slot is configured to receive a pull tab of the overlay applicator extending from the support base out of the overlay applicator machine. The pull tab is configured to be pulled through the end slot to remove an adhesive release liner of the overlay applicator from a bottom side of an overlay layer to expose an adhesive of the overlay layer to the screen of the electronic device. Other embodiments are provided.

An overlay applicator that includes an overlay layer. The overlay layer includes a top side and a bottom side. The bottom side includes an adhesive configured to adhere the overlay layer to a screen of an electronic device. The overlay applicator also includes an adhesive release liner. The adhesive release liner includes a top side and a bottom side. The top side of the adhesive release liner is removably attached to the bottom side of the overlay layer. The adhesive release liner is configured to be removed from the bottom side of the overlay layer to expose the adhesive of the bottom side of the overlay layer. The overlay applicator additionally includes a pull tab layer. The pull tab layer is configured to remove the adhesive release liner from the bottom side of the overlay layer to expose the adhesive and to adhere the overlay layer to the screen. Other embodiments are provided.

A method for welding a ball onto a first component includes the following steps: providing a first component; creating a physical mark in or on the first component; positioning the ball in the place where the physical mark has been created; and welding the ball in a non-contacting manner to the first component using a laser welding device that is positioned at a distance from the first component and the ball.

A connection system for connecting a semifinished product to a positioning member for at least positioning the semifinished product on at least one positioning means of a processing system for processing the semifinished product. The connection system has at least one joining device for joining the semifinished product to the positioning member and at least one placing means placing the positioning member on the connection system.

A method for producing a grinding liquid mixing tank and the structure thereof, the method includes: using a tank body made of PP or PVDF wherein a bottom thereof has a conical arc-shaped wall having at least one wall hole; using a rotor case made of PP or PVDF and including a bottom case wall, a side wall surrounding the bottom case wall, and a connecting wall connected to a top edge of the side wall; heating to soften the rotor case and placing it into the wall hole; using a jig to contact the rotor case, such that the connecting wall is deformed to be coupled to the wall hole; welding a joint between the connecting wall and the wall hole to form the tank body; and a magnetic levitation stirrer is then installed in the tank body to complete the structure of the grinding liquid mixing tank.

Methods, systems, and devices for manufacturing a wearable ring device are described. The manufacturing assembly may rotate, by a rotational component, an inner housing member of the wearable ring device to a radial orientation based on an optical alignment process. A positioning component of the manufacturing assembly may insert and align an optical component of a flexible circuit assembly into at least one aperture of the inner housing member by moving the flexible circuit assembly from a first position adjacent to the inner housing member to a second position on the inner housing member. The manufacturing assembly may secure one or more edges of the flexible circuit assembly onto the inner housing member using a plurality of arms of the positioning component and apply, by an automatic adhesive dispensing device of the manufacturing assembly, a polymeric material to adhere the flexible circuit assembly to the inner housing member.

A system for ultrasonic or vibration welding, staking, swaging, forming or degating of a thermoplastic workpiece includes a vibratable horn having a face, a thermoplastic workpiece, and a vibratable tool positioned between the vibratable horn and the thermoplastic workpiece. The system is configured to energize the vibratable horn to transfer energy from the vibratable horn through the vibratable tool to the thermoplastic workpiece to induce welding, staking, swaging, forming or degating of the thermoplastic workpiece. Optionally, the upper and/or lower surfaces of the vibratable tool may have three-dimensional contour(s) that are complementary to three-dimensional contour(s) of the vibratable horn and/or the thermoplastic workpiece. Additional systems and methods for ultrasonic or vibration welding, staking, swaging, forming or degating of a thermoplastic workpiece are also disclosed.