A bonding preparation patch for application to a resin treated surface is provided. The patch includes a strip having first and second portions, each of which has corresponding first and second sides. The strip is formed of resin porous material and is foldable such that the respective first sides of the first and second portions face each other. The patch further includes a resin barrier interposable between corresponding portions of the respective first sides and a tape including at least one adhesive side, which is securable relative to the first portion and disposable in contact with the second side of the second portion.

The present invention provides a liquid conductivity measurement cell comprising a chamber having an inlet, an outlet and four sensing pins of substantially equal length, said sensing pins being arranged within the chamber around an orbit, each sensing pin defining an electrode, each of said electrodes being switchable between two or more configurations of two sensing pins.

A method is provided for mounting a fiber composite component in the force flow of a clamping connection. The fiber composite material is heated and locally compressed in a mounting region such that the fiber composite material sets by a predefined measure. The fiber composite component is then clamped in the mounting region.

A method is provided for manufacturing an adhesively bonded structure including first and second components including first and second outer surfaces, respectively, at least the first component being a first metal component, the first and second outer surfaces facing one another and partially overlapping, and the adhesively bonded structure including an adhesive layer received between overlapping portions of the first and second outer surfaces. The method includes deforming the first outer surface of the first metal component along a first isolated path extending beside the first edge of the adhesive layer along at least a majority of a length of the first edge of the adhesive layer.

Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

The invention relates to a device for filling a bag, a bag contour welding tool for manufacturing a bag, a welding tool for welding a bag, a method of filling a bag, a method of manufacturing a bag, a plant for manufacturing and filling a bag and to a bag which has been manufactured and filled with such a plant or which has been manufactured with a bag contour welding tool.

The invention allows a filling of a bag, in particular a bag for medical purposes, without the necessity of providing a filling port on the bag.

In this way, resources and costs can be saved, preventing damage to the environment.

Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

The invention relates in general terms to a device for production of a packaging precursor, wherein the packaging precursor consists to an extent of at least 80% by weight, based on the packaging precursor (1000), of a sheetlike composite, wherein the sheetlike composite includes: i. a composite plastic layer, ii. a composite carrier layer, iii. a first composite edge region, iv. a second composite edge region, wherein the device includes, as device constituents in a flow direction: a) a flat transport unit designed to transport the flat sheetlike composite, wherein the transport unit includes a transport surface designed to bear the composite; downstream of that b) a first heating unit designed to heat the first composite edge region, where the first heating unit includes energy release segments; downstream of that c) a contacting unit designed to bond the first composite edge region to the second composite edge region;
wherein the first heating unit is designed to release energy in the flow direction. The invention further relates to a method, to a packaging precursor obtainable by the method, to a packaging precursor and to a use of the device.

The invention relates to a device for welding a connection region of a film to a connection part having an axial direction. In the case of conventional devices, there is the risk of steep workpiece edges causing uncontrolled weak spots in the film and in the weld seam. According to the invention, the film is extended in a controlled manner such that the film has a length reserve. The film is extended in such a way that the film has a deformation cross-section that runs out such that the deformation is not visible on the final product. In this connection, the invention further relates to a use of a film, to a method for welding, to a method for producing bags, to a system for producing bags, and to a bag.

A fiber composite component assembly (100) includes a fiber composite component (3) including a base material and a fiber material, and a tolerance compensation layer (5) for joining the fiber composite component (3) to a further component (1), the tolerance compensation layer (5) including a fiber composite portion (17) and/or a further layer portion (7). A fiber composite component system (200) including a fiber composite component assembly (100) and a further component (1) joined to the fiber composite component assembly (100), as well as a method for producing a fiber composite component system (200), is also provided.