Patent classifications
B29C66/0324
Method for forming, opening and/or evaluating a connection site
System, apparatus and method for opening a heat-bonded connection formed between two hollow, flexible thermoplastic conduits. A pressure difference is created between the inside of at least one of the conduits and the ambient atmosphere sufficient to cause expansion of a wall of the tubing conduit in the vicinity of a frangible portion at least partially blocking the connection to disrupt the frangible portion and reduce the blocking.
Different material bonding apparatus and operation method thereof
Disclosed herein are a different material bonding apparatus and an operation method thereof. The different material bonding apparatus in accordance with the present embodiment includes a first layer and a second layer formed of materials having different melting points and each having one surface contacting one surface of the other and a heater configured to apply heat to the other surface of the second layer, the second layer includes a plurality of penetration grooves formed to be recessed in the one surface contacting the first layer, and a melting point of the second layer is higher than a melting point of the first layer.
Method and apparatus for deployment of a tubular body onto a surface
A method and apparatus for deploying a tubular body onto a surface. The apparatus includes a main body movable in an advancing direction. The apparatus includes a deployment mechanism that deploys a tubular body directly onto a surface. The apparatus includes at least one container that stores an uncured protectant. The container is mounted on the main body. The apparatus may include a second container that stores a second protectant. The second protectant is different than the uncured protectant. The apparatus includes at least one curing device, which can cure the uncured protectant after the uncured protectant is applied to surface.