A method of manufacturing a display device includes: preparing a cover window including a bent part on a side surface thereof, and a guide film including a surface on which a display panel and an adhesive layer are arranged; arranging the cover window and the guide film in a face-to-face manner such that the adhesive layer faces the cover window; seating the guide film onto a seating pad of a first jig; pre-forming the display panel by bringing opposite ends of the guide film into close contact with opposite side surfaces of the seating pad using a pair of push members; and joining the display panel with the cover window by bringing the adhesive layer into contact with the cover window.

A method and installation for joining a cover layer to an object in a continuous process. Joining is effected with the aid of a joining material having thermoplastic properties, wherein the joining material is arranged between the cover layer and the object and is liquefied using ultrasonic vibration energy. Before application of the ultrasonic vibration energy, the joining material is preheated in a contactless manner with the aid of electromagnetic induction in the region of the glass transition temperature of the joining material or above this glass transition temperature. The object is in particular a chip board and the cover layer an edge strip to be joined to an edge of the chip board.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

A method for monitoring the sealing of a container in a system or device is described. The method includes the following steps: controlling the heating element to heat a heating stamp to a predetermined sealing temperature, monitoring the temperature of the heating stamp, determining a temperature over time curve of the heating stamp by means of at least one temperature sensor, determining at least one characteristic of the temperature over time curve, comparing the determined at least one characteristic of the temperature over time curve with a reference value, and determining a sealing property of the sealing of the container based on said comparison of the determined at least one characteristic of the temperature over time curve with the reference value.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

Provided is a manufacturing method of a sheet-through image reading apparatus, including a first step of preparing a contact glass, a second step of bonding, after the first step, a heat-resistant and insulative sheet-shaped material to a predetermined position on a major surface of the contact glass, as a transport guide member, a third step of executing plasma processing on the major surface of the contact glass after the second step, a fourth step of executing a fluorine coating on the major surface of the contact glass after the third step, a fifth step of sintering the contact glass after the fourth step, and a sixth step of fixing the contact glass to a casing of the image reading apparatus, after the fifth step.

In an example of a method of making a flowcell, an organic solid support including sidewalls and a top is provided. A bottom surface of the organic solid support adjacent to the sidewalls provides a laser bonding foot. In the method, the laser bonding foot is bonded to an inorganic solid support to form a channel having sidewalls and a top defined by the organic solid support.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein. The process for laminating works together laminates a work composed of a resin to a work composed of a resin or glass, the process including a surface activation step of treating a laminating surface of at least the work composed of a resin with vacuum ultraviolet ray or with atmospheric pressure plasma, and a bonding step of bonding together the two works stacked on each other such that a laminating surface of one of the works abuts a laminating surface of the other work, wherein in the surface activation step, the treatment of the laminating surfaces with vacuum ultraviolet ray or with atmospheric pressure plasma is terminated when an accumulated treatment quantity of the vacuum ultraviolet ray or the atmospheric pressure plasma applied to the laminating surfaces is within an initial drop range shown in a variation curve of a water contact angle on the laminating surfaces with respect to the accumulated treatment quantity.

A method of anchoring a connector in a first object, wherein the first object is a lightweight building element having a first outer building layer and an interlining layer, and wherein the connector includes thermoplastic material in a solid state. The method includes: bringing a coupling surface portion of the connector into contact with an attachment location of the first outer building layer; displacing a portion of the first outer building layer at the attachment location with respect to the interlining layer by applying a first pressing force to the first outer building layer and thereby piercing the first outer building layer; applying a second pressing force to the connector and transferring energy to the connector until a flow portion of the thermoplastic material has liquefied and flown to interpenetrate structures of the interlining layer; and stopping the energy transfer and allowing the flow portion to re-solidify.