A method and apparatus for forming pouches and/or bags is disclosed. A seal and/or insert is crushed using a multiphase sealer or crusher.

Induction welding process for welding two parts using at least one susceptor including discontinuous conductive elements, and assembly of at least two parts obtained using the induction welding process. An induction welding process can join at least first and second parts, and the process can include a step of positioning at least one susceptor, including discontinuous conductive elements, between the first and second contact faces of the first and second parts, and steps of holding the first and second parts pressed against each other and of producing an electromagnetic field to generate an induced current that engenders heating of the susceptor. An assembly of two parts can be obtained using the process.

There is provided a sealing apparatus for forming void-fill packaging which includes a longitudinal guide path along which an edge of a part-sealed plastics film material can pass, a drive means for moving the film material along the guide path, and an air blowing or injecting means for inflating the film material. There is also provided a heating element and a rigid thermally conductive member which is thermally coupled to the heating element, the thermally conductive member having an film-contacting surface for applying thermal energy to seal the film material on the longitudinal guide path.

A method for joining a device to an object with the aid of a combination of ultrasonic vibration energy and induction heating, wherein the device includes a portion of a thermoplastic polymer and a susceptor additive wherein this portion is at least partly liquefied or plasticized through the ultrasonic vibration energy in combination with the induction heating and wherein the joining includes establishing a connection between the device and the object which connection is at least one of a positive fit connection, a weld, a press fit connection, and an adhesive connection. The induction heating is applied for rendering the device portion suitable for absorption of ultrasonic vibration energy than other device portions by raising its temperature above the glass transition temperature of the polymer. The ultrasonic vibration energy is used for liquefying or at least plasticizing the thermoplastic polymer of the named device portion.

A metal-resin joining device joins a thermoplastic resin plate (12) to a metal plate (13) by melting the resin plate (12) in contact with the metal plate (13) through heating an exposed face of the metal plate (13) by one-sided resistive heating. The metal-resin joining device has a center electrode (24a) that is brought in contact with the metal plate (13) and a peripheral electrode (24b) that is brought in contact with the metal plate (13) to annularly surround the center electrode (24a) and to which a current flows from the center electrode (24a) via the metal plate (13), wherein the peripheral electrode (24b) is made of a metal material having a higher electrical resistance than the center electrode (24a).

Heat-seal condition indicating packages include a first sealing substrate comprising a leuco dye and a second sealing substrate comprising a leuco dye developer. The packages may optionally include a leuco dye sensitizer which dissolves both the leuco dye and the leuco dye developer when melted. The packages further include a heat-seal produced between the first sealing substrate and the second seating substrate. The heat-sea! comprises a reaction product of the leuco dye and the leuco dye developer. The reaction product may be colored, which may provide the heat-seal with a detectable optical characteristic. A magnitude of the optical characteristic may be proportion to the strength of the seal between the first and second seating substrates.

A method and apparatus for forming pouches and/or bags is disclosed. A seal and/or insert is crushed using a multiphase sealer or crusher.

A metal-resin joining device joins a thermoplastic resin plate (12) to a metal plate (13) by melting the resin plate (12) in contact with the metal plate (13) through heating an exposed face of the metal plate (13) by one-sided resistive heating. The metal-resin joining device has a center electrode (24a) that is brought in contact with the metal plate (13) and a peripheral electrode (24b) that is brought in contact with the metal plate (13) to annularly surround the center electrode (24a) and to which a current flows from the center electrode (24a) via the metal plate (13), wherein the peripheral electrode (24b) is made of a metal material having a higher electrical resistance than the center electrode (24a).

The present disclosure is concerned with a method of forming a seal with a polyethylene based film structure. The polyethylene based film structure has at least one layer formed with an oriented polyethylene having a predetermined melting temperature (T.sub.m). A conductive heat sealing device provides heat to form the seal, where a first sealing bar of the conductive heat sealing device operates at a first operating temperature of at least 10 degrees Celsius (? C.) below the T.sub.m of the oriented polyethylene in the polyethylene based film structure and a second sealing bar of the conductive heat sealing device operates at a second operating temperature of at least 15? C. higher than the operating temperature of the first sealing bar. The seal formed with the polyethylene based film structure retains at least 99 percent of its original surface area prior to forming the seal.

The present invention discloses a device for producing a reinforcing structure, which comprises a strip that is fiber-reinforced and comprises thermoplastic material, on the surface of a molding. The device is characterized in that a laser diode array is adapted for irradiating a radiation zone so as to bring about such an uneven intensity distribution on a heating-up area of a strip from which the reinforcing structure is formed that the radiation intensity on the heating-up area of the strip decreases at least in certain portions in a drawing direction R2.