A method of reversible bonding based on deposition of a coating capable of an indefinite number of reversible bonding cycles as enable by bond exchange reactions is provided. This is accomplished by deposition of crosslinkable aromatic polyester oligomers on a substrate. The coated article is heated to produce a fully thermoset network by condensation reactions. The fully thermoset network has access to a type of bond exchange reaction within the resin that permits the dynamic exchange of ester bonds within the resin. To execute the bonding step a source of heat is applied at a pressure. To debond, there is applied force in tension and/or shear that causes the coating to fail. The reversibility of the process is contingent on the cohesive (rather than adhesive) failure of the coating—that is, the coating must not delaminate from the substrate. Failure must occur in the resin of the reversible coating.

Methods and systems are provided for fabricating a composite structure. In one example, the composite structure may include a honeycomb core sandwiched between face sheets. An edge of the honeycomb core may be abraded and a top face sheet may be perforated. As such, a likelihood of delamination of the composite structure during a curing step may be reduced.

A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.

A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.

A metal-carbon fiber reinforced plastic composite comprising a metal member of a ferrous material or ferrous alloy, a resin layer provided on at least one surface of the metal member and including a thermosetting resin, and carbon fiber reinforced plastic provided on a surface of the resin layer and including a carbon fiber material and a matrix resin having thermoplasticity, an indentation elastic modulus at 160 to 180° C. of the resin layer being higher than an indentation elastic modulus at 160 to 180° C. of the matrix resin.

A method for manufacturing a semifinished product or part is disclosed in which a metal support embodied as a metal sheet or blank is covered with at least one prepreg containing a thermally cross-linkable thermosetting matrix with endless fibers, the thermosetting matrix of the prepreg is pre-cross-linked by means of heating, and the metal support covered with the pre-cross-linked prepreg is formed into a semifinished product or part by means of deep drawing or stretch deep drawing. In order to enable plastic deformation in fiber-reinforced regions of the metal support, it is proposed that during the pre-cross-linking of the thermosetting matrix of the prepreg, its matrix is transferred into a viscosity state that is higher than its minimum viscosity and prior to reaching its gel point, the prepreg is formed together with the metal support.

This invention relates to the production of cured polymeric skin materials. In particular, the invention relates to methods and substrates for the production of skin materials, for example, for use in building, furniture, and as architectural components for example in roofing materials such as roofing tiles, or for brick wall effect materials.

The present disclosure provides a light-weight flexible high-thermal-conductivity nano-carbon composite film and a method for preparing same. The nano-carbon composite film includes a plurality of composite units laminated sequentially. The, composite unit includes flexible adhesive layers and a graphene film layer, and the flexible adhesive layers are disposed on both sides of the graphene film layer. The preparation method includes sequentially laminating the composite units and hot pressing to obtain the nano-carbon composite film. The nano-carbon composite film has the characteristics of high thermal conductivity, light weight and flexibility, and has an in-plane thermal conductivity of up to 500 W/m.Math.K or higher, a density of 2.0 g/cm.sup.3 or less, and still a thermal conductivity of 500 W/m.Math.K or higher after the nano-carbon composite film is repeatedly bent by 180 for 50 times while there is no peeling of graphene from the surface.

A composite of metal and carbon-fiber-reinforced plastic according to the present invention comprising a predetermined metal member, a resin layer positioned at a surface of at least part of the metal member and containing an inorganic filler having a thermal conductivity of 20 W/(m.Math.K) or more, and carbon fiber reinforced plastic positioned on the resin layer and containing a predetermined matrix resin and carbon reinforcing fiber present in the matrix resin, the carbon reinforcing fiber being at least one of pitch-based carbon reinforcing fiber having a thermal conductivity of 180 to 900 W/(m.Math.K) in range or PAN-based carbon reinforcing fiber having a thermal conductivity of 100 to 200 W/(m.Math.K) in range, a content of the inorganic filler in the resin layer being 10 to 45 vol % in range with respect to a total volume of the resin layer, a number density of the inorganic filler present in a region of a width X m from an interface of the resin layer and the carbon fiber reinforced plastic in a direction of the resin layer being 300/mm.sup.2 or more, where X m is an average particle size of the inorganic filler.

A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.