The present disclosure relates to a method of preventing corrosion of mating surfaces of components. The method comprising impregnating a polyester based carrier with an anaerobic acrylic adhesive to form an impregnated carrier and spraying a pressure sensitive acrylic adhesive on one surface of the impregnated carrier to form an impregnated carrier having a pressure sensitive acrylic adhesive layer, which is protected using a protective silicon release liner to configure a pasting surface. The pasting surface is pasted on a first component, such that pasting layer is in contact with first component. A second component is abutted to first component with the impregnated carrier there between and force is applied on first and second components such that the anaerobic acrylic adhesive oozes out from the impregnated carrier and coats both mating surfaces in absence of oxygen to commence and complete curing of anaerobic acrylic adhesive on the mating surfaces of the first and the second components.

There is provided a composite structure, comprising a base member(s) made of metallic material, and a reinforcement member(s) made of fiber reinforced plastic including reinforcement fibers which are aligned in a uni-direction, wherein at least one slit is formed on the reinforcement member(s) so as to extend in an orientation direction of the reinforcement fibers.

Method for manufacturing an optical display device which allows for appropriately correcting a linear deformation generated on a pressure-sensitive adhesive layer in laminating an optical functional film with a panel member includes steps of peeling a sheet of optical functional film together with the pressure-sensitive adhesive layer from a carrier film up to a predetermined head-out length, stopping the conveyance of the carrier film for detecting the front edge, making the front edge of the sheet of optical functional film proceed to the laminating position, laminating from the front edge to a predetermined position upstream of the head-out length on the sheet of optical functional film with the panel member at a first lamination speed, and laminating at least a part from the predetermined position to a rear edge of the sheet of optical functional film with the panel member at a speed faster than the first lamination speed.

Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

Compositions and designs are described for a sectional porous carrier used in processing microelectronics where thin device substrates are affixed by adhesive to the carrier and form an impervious bonded stack that is resistant to thermal and chemical products during processing and is easily handled by a substrate handling vacuum robot, and subsequently allows rapid removal (debonding) in batch operations by directional penetration into sectional porous regions by selective liquids which release the carrier from the device wafer without harm. The invention carrier with porous regions is used for temporary support of thin and fragile device substrates having capabilities of selective penetration of chemical liquids to pass through the porous regions, access and breakdown the bonding adhesive, and allow it to release without damage to the device substrate. The sectional porous nature of the carrier allows passive diffusion of chemical liquids, the manner which in contrast to mechanical, thermal, or radiative methods, is considered to be a higher yield practice and one which enables batch processing in a manufacturing environment utilizing practices of high throughput and low cost. Preferred designs include the use of porous metal forms, including laminates, as well as surface treatment of the porous regions to facilitate exclusion principles and achieve an inert support mechanism during the stages of device manufacture. These benefits allow design flexibility and low-cost batch processing when choosing practices to handle thinned device substrates in the manufacture of semiconductors and other microelectronic devices.

There is provided a method of manufacturing a thin polarizing plate including: forming a film laminate by attaching a non-stretched polyvinyl alcohol (PVA)-based film to a non-stretched base film, using attractive force therebetween or using an adhesive; stretching the film laminate; attaching a first protective film to the PVA-based film of the stretched film laminate; and separating the PVA-based film having the first protective film attached thereto from the base film.

The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1):

##STR00001##

and
a diamine of Formula (2) or (3):

##STR00002##

wherein G, P, R, R.sub.x, P, D, E and m are as defined herein.

The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

An apparatus for applying security elements, comprises at least one value document substrate transport device for transporting a value document substrate web, at least one security elements transport device for transporting a security elements carrier band having a plurality of security elements, wherein the security elements carrier band has a first and a second main surface which oppose each other, each security element has a first and a second main surface which oppose each other, each security element is arranged with its first main surface on the first main surface of the security elements carrier band, and each security element has adhesive properties at its second main surface, wherein the apparatus has an application region in order to apply the security elements with their second main surface onto the value document substrate web. A security elements carrier band and a value document involve the apparatus.

The present disclosure relates to a method of preventing corrosion of mating surfaces of components. The method comprising impregnating a polyester based carrier with an anaerobic acrylic adhesive to form an impregnated carrier and spraying a pressure sensitive acrylic adhesive on one surface of the impregnated carrier to form an impregnated carrier having a pressure sensitive acrylic adhesive layer, which is protected using a protective silicon release liner to configure a pasting surface. The pasting surface is pasted on a first component, such that pasting layer is in contact with first component. A second component is abutted to first component with the impregnated carrier there between and force is applied on first and second components such that the anaerobic acrylic adhesive oozes out from the impregnated carrier and coats both mating surfaces in absence of oxygen to commence and complete curing of anaerobic acrylic adhesive on the mating surfaces of the first and the second components.

The present invention relates to a method and an assembly for manufacturing a leaf spring from a fiber-composite material. To this end, tape material from a fiber material, which has been pre-impregnated with a matrix resin, for manufacturing a semi-finished leaf spring is wound under tension onto a winding core, wherein at least two cavities for shaping are configured on the winding core. The tape material here is pressed on by way of a contact pressure means, such that adjacent layers of the fiber material are adhesively interconnected and air pockets are removed. The semi-finished leaf spring under impingement by pressure and heat and under curing of the matrix resin is finally processed to form a leaf spring.