System for manufacturing an assembly board includes an undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, a carry-in side delivering unit having different first and second receiving positions, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The carry-in side delivering unit delivers the undersupporting device to the transporter, which transports the undersupporting device to a working position. The undersupporting-device is fixed to the undersupporting-device installer. The carry-in side delivering unit delivers the board to the transporter, which transports the board to the working position.

System for manufacturing an assembly board includes an undersupporting device, a transporter, an undersupporting-device installer attachable to and detachable from the undersupporting device, a board processor, a carry-in side delivering unit having different first and second receiving positions, a board supplier configured to supply the board to the first receiving position, and an undersupporting-device supplier configured to supply the undersupporting device to the second receiving position. The carry-in side delivering unit delivers the undersupporting device to the transporter, which transports the undersupporting device to a working position. The undersupporting-device is fixed to the undersupporting-device installer. The carry-in side delivering unit delivers the board to the transporter, which transports the board to the working position.

An apparatus, a recording medium, and a method for generating a control parameter of a screen printer are disclosed. The apparatus includes a memory that stores a simulation model configured to derive predictive inspection information on a printed state of solder paste based on a plurality of control parameters of the screen printer; a communication circuit configured to receive first inspection information on a plurality of solder pastes printed by the screen printer based on a first control parameter, and a processor electrically connected to the memory and the communication circuit. The processor obtains first predictive inspection information by applying the first control parameter to the simulation model, generates a plurality of candidate control parameters based on the first predictive inspection information, determines a plurality of second control parameters among the candidate control parameters, and transmits the plurality of second control parameters to the screen printer via the communication circuit.

A screen printer including a squeegee device to spread from above solder paste on a stencil; a clamp device to grip a board conveyed to a position below the stencil by a board conveyance member that is flat and provided with a board holding portion in a central opening portion, the clamp device gripping the board via the board conveyance member; a board supporting device to support the board from below and move the board in a vertical direction inside the clamp device; and a raising and lowering device to move the board supported inside the clamp device in the vertical direction and position the board at a printing position, and the clamp device is provided with a board printing guide member to be removably attached to an upper end of a pair of clamp members to sandwich the board conveyance member in a widthwise direction.

A screen printer including a squeegee device to spread from above solder paste on a stencil; a clamp device to grip a board conveyed to a position below the stencil by a board conveyance member that is flat and provided with a board holding portion in a central opening portion, the clamp device gripping the board via the board conveyance member; a board supporting device to support the board from below and move the board in a vertical direction inside the clamp device; and a raising and lowering device to move the board supported inside the clamp device in the vertical direction and position the board at a printing position, and the clamp device is provided with a board printing guide member to be removably attached to an upper end of a pair of clamp members to sandwich the board conveyance member in a widthwise direction.

A printed circuit board inspection apparatus obtains measurement shape information about each of a plurality of solder pastes printed on a first printed circuit board through a plurality of apertures and aperture shape information about each of the plurality of apertures, obtains probability values that a first solder paste printed through a first aperture of the plurality of apertures and each of a plurality of second solder pastes printed through second apertures other than the first aperture of the plurality of apertures have the measurement shape information when the first solder paste and the plurality of second solder pastes are printed on the first printed circuit board, by applying the measurement shape information and the aperture shape information to a machine-learning based model, and detects whether an anomaly in the first solder paste occurred based on the probability values.

A printed circuit board inspection apparatus generates at least one image indicating whether an anomaly associated with a plurality of solder pastes printed on a first printed circuit board is detected, if an anomaly in at least one solder paste of the plurality of solder pastes is detected by using an image of the first printed circuit board, obtains at least one value indicating relevance between at least one fault type and the generated at least one image, using the machine-learning based model, and determines a fault type associated with the at least one solder paste in which the anomaly is detected from at least one fault type, based on the obtained at least one value.

A print head assembly of a stencil printer includes a print head frame and a wiper blade assembly coupled to the print head frame. The wiper blade assembly includes wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The wiper blades are configured to force solder paste through the apertures of the stencil. The print head assembly further includes a dispensing unit coupled to the print head frame. The dispensing unit is disposed between the wiper blades to deposit solder paste between the wiper blades. The dispensing unit includes a cartridge receiver. The print head assembly further includes a cartridge positioned in the cartridge receiver and a sensor coupled to the print head frame proximate the cartridge. The sensor is configured to measure a temperature of the cartridge.

A print head assembly of a stencil printer includes a print head frame and a wiper blade assembly coupled to the print head frame. The wiper blade assembly includes wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The wiper blades are configured to force solder paste through the apertures of the stencil. The print head assembly further includes a dispensing unit coupled to the print head frame. The dispensing unit is disposed between the wiper blades to deposit solder paste between the wiper blades. The dispensing unit includes a cartridge receiver. The print head assembly further includes a cartridge positioned in the cartridge receiver and a sensor coupled to the print head frame proximate the cartridge. The sensor is configured to measure a temperature of the cartridge.

A mounting system including a printing device that prints a viscous fluid on a processing target object using a screen mask, an exchange unit disposed in the printing device and configured to automatically exchange a printing related member for use in the printing device between the printing device and the exchange unit, one or more mounting devices including a mounting section configured to mount a component on the processing target object, and a moving work device configured to move around a circumference of the mounting device to automatically attach and detach a mounting related member for use in the mounting device between the mounting device and the moving work device. The printing device and the mounting device are disposed in such a manner that front surfaces thereof lie on the same side, and the exchange unit and the moving work device are disposed on the same side.